SC667 datasheet(24/47 Pages) SEMTECH

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SC667

Applications Information (continued)

PCB Layout Considerations

The layout diagram in Figure 17 illustrates a two-layer

PCB layout for the SC667 and supporting components.

F o l l o w i n g f u n d a m e n t a l l a y o u t r u l e s i s

critical for achieving the performance specified in the

Electrical Characteristics table. The following guidelines

are recommended when developing a PCB layout:

Place all bypass and decoupling capacitors —

IN, CLDO1, CLDO2, CLDO3, CLDO4, and CBYP as close to

the device as possible.

Ensure that all connections to pins IN and OUT

make use of wide traces so that the resistive

drop on each connection is minimized.

The thermal pad should be connected to the

ground plane using multiple vias to ensure

proper thermal connection for optimal heat

transfer.

LDO1, CLDO2, CLDO3, CLDO4, and CBYP should be

grounded together. Connect these capacitors to

the ground plane at one point near the SC667 as

shown in Figure 17.

•

Figure 18 shows the component copper layer.

Make all ground connections to a solid ground

plane as shown in Figure 19.

All LDO output traces should be made as wide

as possible to minimize resistive losses.

•

Figure 17 — Recommended PCB Layout

Figure 18 — Layer 1

Figure 19 — Layer 2

CLDO1

PWM

BL7

IRQ

SDA

SCL

LDO1

BL1

VIN

SC667

GND

VIN

ADI

CBYP

GND

Ground

Plane

CIN

CLDO2

CLDO3

CLDO4

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