PACKAGE OPTION ADDENDUM

www.ti.com

27-Sep-2010

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins

Package Qty

Eco Plan

(2)

Lead/

Ball Finish

MSL Peak Temp

(3)

Samples

(Requires Login)

ADS1194CZXGR

PREVIEW

NFBGA

ZXG

64

TBD

Call TI

Call TI

Samples Not Available

ADS1194CZXGT

PREVIEW

NFBGA

ZXG

64

TBD

Call TI

Call TI

Samples Not Available

ADS1194IPAG

PREVIEW

TQFP

PAG

64

TBD

Call TI

Call TI

Samples Not Available

ADS1194IPAGR

PREVIEW

TQFP

PAG

64

TBD

Call TI

Call TI

Samples Not Available

ADS1196CZXGR

PREVIEW

NFBGA

ZXG

64

TBD

Call TI

Call TI

Samples Not Available

ADS1196CZXGT

PREVIEW

NFBGA

ZXG

64

TBD

Call TI

Call TI

Samples Not Available

ADS1196IPAG

PREVIEW

TQFP

PAG

64

TBD

Call TI

Call TI

Samples Not Available

ADS1196IPAGR

PREVIEW

TQFP

PAG

64

TBD

Call TI

Call TI

Samples Not Available

ADS1198CPAG

ACTIVE

TQFP

PAG

64

160

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

Request Free Samples

ADS1198CPAGR

ACTIVE

TQFP

PAG

64

1500

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

Purchase Samples

ADS1198CZXGR

PREVIEW

NFBGA

ZXG

64

TBD

Call TI

Call TI

Samples Not Available

ADS1198CZXGT

PREVIEW

NFBGA

ZXG

64

TBD

Call TI

Call TI

Samples Not Available

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)