OPA2140 datasheet(16/25 Pages) TI

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100

110

120

130

140

150

160

Ambient Temperature ( C)

MAXIMUM SUPPLY VOLTAGE

(Quiescent Condition)

TSSOP Quad

SOIC Quad

MSOP Dual

SOIC Dual

100

110

120

130

140

150

160

Ambient Temperature ( C)

MAXIMUM SUPPLY VOLTAGE

(Maximum DC Load on All Channels)

TSSOP Quad

SOIC Quad

MSOP Dual

SOIC Dual

OPA140

OPA2140, OPA4140

SBOS498A – JULY 2010 – REVISED AUGUST 2010

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particular semiconductor fabrication process and

specific circuits connected to the pin. Additionally,

internal electrostatic discharge (ESD) protection is

built

into

these

circuits

protect

them

from

accidental ESD events both before and during

product assembly.

It is helpful to have a good understanding of this

basic ESD circuitry and its relevance to an electrical

overstress event. See Figure 38 for an illustration of

the ESD circuits contained in the OPAx140 series

(indicated by the dashed line area). The ESD

protection circuitry involves several current-steering

diodes connected from the input and output pins and

routed back to the internal power-supply lines, where

they meet at an absorption device internal to the

operational amplifier. This protection circuitry is

intended to remain inactive during normal circuit

operation.

Figure 36. Maximum Supply Voltage vs

ESD

event

produces

short

duration,

Temperature (OPA2140 and OPA4140), Quiescent

high-voltage pulse that is transformed into a short

Condition

duration, high-current pulse as it discharges through

a semiconductor device. The ESD protection circuits

are designed to provide a current path around the

operational amplifier core to prevent it from being

damaged. The energy absorbed by the protection

circuitry is then dissipated as heat.

When an ESD voltage develops across two or more

of the amplifier device pins, current flows through one

or more of the steering diodes. Depending on the

path that the current takes, the absorption device

may activate. The absorption device has a trigger, or

threshold voltage, that is above the normal operating

voltage of the OPAx140 but below the device

breakdown voltage level. Once this threshold is

exceeded, the absorption device quickly activates

and clamps the voltage across the supply rails to a

safe level.

When the operational amplifier connects into a circuit

such as the one Figure 38 shows, the ESD protection

Figure 37. Maximum Supply Voltage vs

components are intended to remain inactive and not

Temperature (OPA2140 and OPA4140), Maximum

become involved in the application circuit operation.

DC Load

However, circumstances may arise where an applied

voltage exceeds the operating voltage range of a

given pin. Should this condition occur, there is a risk

ELECTRICAL OVERSTRESS

that some of the internal ESD protection circuits may

be biased on, and conduct current. Any such current

Designers often ask questions about the capability of

flow occurs through steering diode paths and rarely

operational

amplifier

withstand

electrical

involves the absorption device.

overstress. These questions tend to focus on the

device inputs, but may involve the supply voltage pins

or even the output pin. Each of these different pin

functions have electrical stress limits determined by

the

voltage

breakdown

characteristics

the

Product Folder Link(s): OPA140 OPA2140 OPA4140

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