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AXT7 Datasheet(PDF) 2 Page - Panasonic Semiconductor

Part # AXT7
Description  NARROW-PITCH FOR BOARD-TO-FPC CONNECTION
PDF  4 Pages
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Manufacturer  PANASONIC [Panasonic Semiconductor]
Direct Link  http://www.panasonic.com/industrial/
Logo PANASONIC - Panasonic Semiconductor

AXT7 Datasheet(HTML) 2 Page - Panasonic Semiconductor

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AXT7, 8
PRODUCT TYPES
Notes: 1. Order unit: For mass production: in 1-inner-box (1-reel) units
Samples for mounting check: in 50-connector units. Please contact our sales office.
2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our
sales office.
3. Please contact us for connectors having a number of contacts other than those listed above.
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Mated height
Number of contacts
Part number
Packing
Socket
Header
Inner carton
Outer carton
1.0mm
40
AXT740124
AXT840124
3,000 pieces
6,000 pieces
50
AXT750124
AXT850124
60
AXT760124
AXT860124
70
AXT770124
AXT870124
80
AXT780124
AXT880124
Item
Specifications
Conditions
Electrical
characteristics
Rated current
0.25A/contact (Max. 4 A at total contacts)
Rated voltage
60V AC/DC
Breakdown voltage
150V AC for 1 min.
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Insulation resistance
Min. 1,000M
Ω (initial)
Using 250V DC megger (applied for 1 min.)
Contact resistance
Max. 100m
Ω
Based on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force
Max. 0.981N/contacts
× contacts (initial)
Composite removal force
Min. 0.165N/contacts
× contacts
Contact holding force
(Socket contact)
Min. 0.49N/contacts
Measuring the maximum force.
As the contact is axially pull out.
Environmental
characteristics
Ambient temperature
–55
°C to +85°C
No freezing at low temperatures. No dew condensation.
Soldering heat resistance
Peak temperature: 260
°C or less (on the surface of
the PC board around the connector terminals)
Infrared reflow soldering
300
°C within 5 sec. 350°C within 3 sec.
Soldering iron
Storage temperature
–55
°C to +85°C (product only)
–40
°C to +50°C (emboss packing)
No freezing at low temperatures. No dew condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100M
Ω,
contact resistance max. 100m
Ω
Sequence
1. –55
°C, 30 minutes
2. ~ , Max. 5 minutes
3. 85
°C, 30 minutes
4. ~ , Max. 5 minutes
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100M
Ω,
contact resistance max. 100m
Ω
Bath temperature 40
±2°C,
humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100M
Ω,
contact resistance max. 100m
Ω
Bath temperature 35
±2°C,
saltwater concentration 5
±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 100m
Ω
Bath temperature 40
±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life
50 times
Repeated insertion and removal speed of max. 200 times/
hours
Unit weight
40-contact type: Socket: 0.04 g Header: 0.02 g
Part name
Material
Surface treatment
Molded
portion
LCP resin
(UL94V-0)
—
Contact and
Post
Copper alloy
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Clips (soldering terminals): Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating (except the terminal tips)
0
−3
+3
0
panasonic-electric-works.net/ac



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