347 datasheet(10/95 Pages) INTEL

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Introduction

Datasheet

1.1.1

Processor Packaging Terminology

Commonly used terms are explained here for clarification:

• Intel® Celeron® D Processor 300 sequence on 65 nm process in the 775-

land Package— Processor in the FC-LGA6 package with a 512 KB L2 cache.

• Processor — For this document, the term processor is the generic form of the

Celeron D processor.

• Keep-out zone — The area on or near the processor that system design can not

use.

•Intel® 945G/945GZ/945P/945PL Express chipset family — Chipset that

supports DDR and DDR2 memory technology for the Celeron D processor on 65 nm

process.

• Processor core — Processor core die with integrated L2 cache.

• LGA775 socket — The Celeron D processor on 65 nm process mates with the

system board through a surface mount, 775-land, LGA socket.

• Integrated heat spreader (IHS) —A component of the processor package used

to enhance the thermal performance of the package. Component thermal solutions

interface with the processor at the IHS surface.

• Retention mechanism (RM) — Since the LGA775 socket does not include any

mechanical features for heatsink attach, a retention mechanism is required.

Component thermal solutions should attach to the processor via a retention

mechanism that is independent of the socket.

• FSB (Front Side Bus) — The electrical interface that connects the processor to

the chipset; also referred to as the processor system bus or the system bus. All

memory and I/O transactions as well as interrupt messages pass between the

processor and chipset over the FSB.

• Storage conditions — Refers to a non-operational state. The processor may be

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or

exposed to free air. Under these conditions, processor lands should not be

connected to any supply voltages, have any I/Os biased, or receive any clocks.

Upon exposure to “free air”(i.e., unsealed packaging or a device removed from

packaging material) the processor must be handled in accordance with moisture

sensitivity labeling (MSL) as indicated on the packaging material.

• Functional operation — Refers to normal operating conditions in which all

processor specifications, including DC, AC, system bus, signal quality, mechanical

and thermal are satisfied.

347 Datasheet(PDF) 10 Page - Intel Corporation