QX6000 datasheet(88/98 Pages) INTEL

Part #	QX6000

Description	on 65 nm Process in the 775-land LGA Package supporting Intel 64 architecture

PDF	98 Pages

Scroll/Zoom	100%

Manufacturer	INTEL [Intel Corporation]

Direct Link	http://www.intel.com

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88 / 98 page

Boxed Processor Specifications

Datasheet

7.1

Mechanical Specifications

7.1.1

Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed processor. The

boxed processor will be shipped with an unattached fan heatsink. Figure 22 shows a

mechanical representation of the boxed processor.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper

cooling. The physical space requirements and dimensions for the boxed processor with

assembled fan heatsink are shown in Figure 23 (Side View), and Figure 24 (Top View).

The airspace requirements for the boxed processor fan heatsink must also be

incorporated into new baseboard and system designs. Airspace requirements are

shown in Figure 28 and Figure 29. Note that some figures have centerlines shown

(marked with alphabetic designations) to clarify relative dimensioning.

Figure 23.

Space Requirements for the Boxed Processor (Side View)

Boxed Proc SideView

95.0

[3.74]

10.0

[0.39]

25.0

[0.98]

81.3

[3.2]

QX6000 Datasheet(PDF) 88 Page - Intel Corporation