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MAX8686 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX8686
Description  Single/Multiphase, Step-Down, DC-DC Converter Delivers Up to 25A Per Phase
PDF  23 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX8686 Datasheet(HTML) 2 Page - Maxim Integrated Products

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Single/Multiphase, Step-Down,
DC-DC Converter Delivers Up to 25A Per Phase
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = VINA = 12V, VL = AVL, VREFIN = 1V, VRS+ - VRS- = 1V, VRS- = 0V, VEN/SLOPE = 1.25V, VCS+ = VCS- = 1V, RILIM = 122kΩ, CVL = 1μF,
CAVL = 0.22μF, CFREQ = 270pF, TA = +25°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
IN, INA to PGND.....................................................-0.3V to +22V
BST, DH to LX...........................................................-0.3V to +6V
BST to PGND..........................................................-0.3V to +28V
LX to PGND...........................-0.3V to (VIN + 0.3V) (-2V for 50ns)
BST to VL................................................................-0.3V to +22V
AVL to GND.................................................-0.3V to (VVL + 0.3V)
COMP, ILIM, FREQ, PHASE/REFO, RS+, RS-, POK, REFIN,
CS+, CS- to GND ..................................-0.3V to (VAVL + 0.3V)
VL to PGND ..............................................................-0.3V to +6V
EN/SLOPE to GND ...................................................-0.3V to +6V
RTN to PGND to GND to GFREQ ..........................-0.3V to +0.3V
IN Continuous Current.....................................................20ARMS
LX Continuous Current ....................................................25ARMS
Continuous Power Dissipation (TA = +70°C) (Note 1)
40-Pin TQFN (derate 50mW/°C above +70°C) ..........4000mW
θJC (thermal resistance from junction to exposed pad)
(Note 1) ......................................................................3.5°C/W
θJT (thermal resistance from junction to top) (Note 1) ...3.9°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
Operating Input-Voltage Range
VINA = VIN , TA = -40°C to +85°C
6
20
V
Operating Input-Voltage Range
VIN = VINA = VVL = VAVL, TA = -40°C to +85°C
4.5
5.5
V
TA = +25°C
450
IN/INA Shutdown Supply Current
VEN/SLOPE = 0V,
VIN = VINA = 20V
TA = +85°C
500
μA
IN/INA Quiescent Supply Current
VRS+ = 1.1V, no switching; VIN = VINA = 20V,
TA = -40°C to +85°C
5.5
6.6
mA
Rising, TA = -40°C to +85°C
4.2
4.35
4.45
AVL Undervoltage Lockout Trip
Level
Falling
4.03
V
VL Output Voltage
6V
≤ VIN = VINA ≤ 20V, 1mA ≤ IVL ≤ 30mA,
TA = -40°C to +85°C
5.2
5.4
5.5
V
SOFT-START (SS)
SS Shutdown Resistance
VEN/SLOPE = 0V (master mode)
20
100
Ω
SS Soft-Start Current
VSS = 0.4V and 1.1V, TA = -40°C to +85°C
19
25
31
μA
PHASE COMPARATOR AND REFERENCE (PHASE/REFO)
Reference Output Voltage
Measured at PHASE/REFO (master mode),
TA = -40°C to +85°C
3.267
3.300
3.333
V
PHASE Comparator Offset
VRS- = VAVL (slave mode), VPHASE = 0.3V and 2.5V,
TA = -40°C to +85°C
-20
+20
mV
REFIN INPUT
REFIN Input Bias Current
VREFIN = 0.7V or 3.3V
-500
+500
nA
REFIN Input Voltage Range
0
3.3
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations see www.maxim-ic.com/thermal-tutorial.



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