EMI7204MU, EMI7206MU, EMI7208MU

http://onsemi.com

5

PACKAGE DIMENSIONS

UDFN8, 1.7x1.35, 0.4P

CASE 517BC−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.25 mm FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

B

E

D

D2

E2

BOTTOM VIEW

b

e

8X

0.10

B

0.05

A

C

C

K

8X

NOTE 3

2X

0.10 C

PIN ONE

REFERENCE

TOP VIEW

2X

0.10 C

8X

A

A1

(A3)

0.05 C

0.05 C

PLANE

SIDE VIEW

L

8X

1

8

DIM MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.15

0.25

D

1.70 BSC

D2

1.10

1.30

E

1.35 BSC

E2

0.30

0.50

e

0.40 BSC

K

0.15

−−−

L

0.20

0.30

DETAIL B

1.40

0.25

0.50

1.55

0.40 PITCH

DIMENSIONS: MILLIMETERS

0.40

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1

PACKAGE

OUTLINE

L1

−−−

0.05

8X

A1

A3

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL A

NOTE 4

e/2

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

L

RECOMMENDED

8X