MIC184BMM datasheet(3/20 Pages) MICREL

3 / 20 page

May 2006

MIC184

Micrel

Absolute Maximum Ratings (Note 1)

Power Supply Voltage, VDD..........................................6.0V

Voltage on Any Pin ................................–0.3V to VDD+0.3V

Current Into Any Pin ................................................... ±6mA

Power Dissipation, TA = +125°C................................30mW

Junction Temperature.............................................. +150°C

Storage Temperature................................ –65°C to +150°C

ESD Ratings (Note 3)

Human Body Model..................................................... 700V

Machine Model ............................................................ 100V

Soldering

Vapor Phase (60 sec.) .............................. +220°C +5⁄–0°C

Infrared (15 sec.) ......................................+235°C +5⁄–0°C

Operating Ratings (Note 2)

Power Supply Voltage, VDD......................... +2.7V to +5.5V

Ambient Temperature Range (TA) .............-55°C to +125°C

Package Thermal Resistance (θJA)

SOP .................................................................+152°C/W

MSOP ..............................................................+206°C/W

Electrical Characteristics

2.7V ≤ VDD ≤ 5.5; TA = +25°C, bold values indicate –55°C ≤ TA ≤ +125°C, Note 4; unless noted.

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply

IDD

Supply Current

INT open, A2, A1, A0 = VDD or GND,

340

500

µA

CLK = DATA = high, normal mode

shutdown mode, CLK = 100kHz

2.5

µA

INT open, A2, A1, A0 = VDD or GND,

µA

CLK = DATA = high, shutdown mode

tPOR

Power-On Reset Time

VDD > VPOR

100

µs

VPOR

Power-On Reset Voltage

all registers reset to default values,

2.0

2.7

A/D conversions initiated

VHYST

Power-On Reset

Hysteresis Voltage

250

Temperature-to-Digital Converter Characteristics

Accuracy—Local Temperature

0°C ≤ TA ≤ +100°C, INT open,

±1

±2

°C

Note 5, 6

3V ≤ VDD ≤ 3.6V

–55°C ≤ TA ≤ +125°C, INT open,

±2

±3

°C

3V ≤ VDD ≤ 3.6V

Accuracy—Remote Temperature

0°C ≤ TD ≤ +100°C, INT open,

±1

±3

°C

Note 5, 6, 7

3V ≤ VDD ≤ 3.6V, 0°C ≤ TA ≤ +85°C

–55°C ≤ TD ≤ +125°C, INT open,

±2

±5

°C

3V ≤ VDD ≤ 3.6V, 0°C ≤ TA ≤ +85°C

tCONV

Conversion Time,

Note 5

local temperature

100

160

remote temperature

200

320

Remote Temperature Input (T1)

Current to External Diode

high level

224

400

µA

Note 5

low level

7.5

µA

Address Inputs (A2/T1, A1, A0)

VIL

Low Input Voltage

2.7V ≤ VDD ≤ 5.5V

0.6

VIH

High Input Voltage

2.7V ≤ VDD ≤ 5.5V

2.0

CIN

Input Capacitance

ILEAK

Input Current

±0.01

±1

µA

IPD

Pulldown Current on A2/T1

A2 = VDD, ﬂows for tPOR at power-up

µA

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