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MIC5239BMM Datasheet(PDF) 5 Page - Micrel Semiconductor |
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MIC5239BMM Datasheet(HTML) 5 Page - Micrel Semiconductor |
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5 / 14 page ![]() Micrel MIC5239 December 2007 5 M9999-121007 Notes: 1. Exceeding the absolute maximum rating may damage the device. 2. The device is not guaranteed to function outside its operating rating. 3. The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The θJA of the MIC5239- x.xBMM (all versions) is 80°C/W, the MIC5239-x.xBM (all versions) is 63°C/W, and the MIC5239-x.xBS (all versions) is 50°C/W mounted on a PC board, see “Thermal Characteristics” for further details. 4. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5kΩ in series with 100pF. 5. Specification for packaged product only. 6. Regulation is measured at constant junction temperature using pulse testing with a low duty-cycle. Changes in output voltage due to heating effects are covered by the specification for thermal regulation. 7. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1.0V differential. |
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