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MIC33030 Datasheet(PDF) 13 Page - Micrel Semiconductor

Part # MIC33030
Description  8MHz 400mA Internal Inductor Buck Regulator with HyperLight Load
PDF  18 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC33030 Datasheet(HTML) 13 Page - Micrel Semiconductor

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Micrel Inc.
MIC33030
February 2011
13
M9999-020311-C
Power Dissipation Considerations
As with all power devices, the ultimate current rating of
the output is limited by the thermal properties of the
package and the PCB it is mounted on. There is a
simple, ohms law type relationship between thermal
resistance, power dissipation and temperature which are
analogous to an electrical circuit:
From this simple circuit we can calculate Vx if we know
Isource, Vz and the resistor values, Rxy and Ryz using
the equation:
() Vz
Ryz
Rxy
Isource
Vx
+
+
⋅
=
Thermal circuits can be considered using these same
rules and can be drawn similarly replacing current
sources with Power dissipation (in Watts), Resistance
with Thermal Resistance (in
ºC/W) and Voltage sources
with temperature (in
ºC):
Now replacing the variables in the equation for Vx, we
can find the junction temperature (TJ) from power
dissipation, ambient temperature and the known thermal
resistance of the PCB (R
θCA) and the package (RθJC):
()
CA
JC
DISS
J
R
R
P
T
+
⋅
=
AMB
T
+
θ
θ
As can be seen in the diagram, total thermal resistance
R
θJA = RθJC + RθCA. Hence this can also be written:
()
AMB
JA
DISS
J
T
R
P
T
+
⋅
=
θ
Since effectively all of the power loss in the converter is
dissipated within the MIC33030 package, PDISS can be
calculated thus:
)
(
1
1
P
P
OUT
DISS
−
⋅
=
η
Where
η = Efficiency taken from efficiency curves
R
θJC and RθJA are found in the operating ratings section
of the datasheet.
Example:
A MIC33030 is intended to drive a 300mA load at 1.8V
and is placed on a printed circuit board which has a
ground plane area of at least 25mm square. The Voltage
source is a Li-ion battery with a lower operating
threshold of 3V and the ambient temperature of the
assembly can be up to 50
ºC.
Summary of variables:
IOUT = 0.3A
VOUT = 1.8V
VIN = 3V to 4.2V
TAMB = 50
ºC
R
θJA = 76
ºC/W from Datasheet
η @ 300mA = 75% (worst case with VIN=4.2V from the
Typical Characteristics Efficiency vs. Load graphs)
)
.
(
.
.
1
75
0
1
3
0
8
1
PDISS
−
⋅
⋅
=
= 0.18W
The worst case switch and inductor resistance will
increase at higher temperatures, so a margin of 20% can
be added to account for this:
PDISS = 0.18 x 1.2 = .216W
Therefore:
TJ = 0.216W. (76
ºC/W) + 50ºC
TJ = 66
ºC
This is well below the maximum 125
ºC.



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