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LTC2641 Datasheet(PDF) 23 Page - Linear Technology |
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LTC2641 Datasheet(HTML) 23 Page - Linear Technology |
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23 / 24 page ![]() LTC2379-18 23 237918p Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. PACKAGE DESCRIPTION 3.00 ±0.10 (2 SIDES) 4.00 ±0.10 (2 SIDES) NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.40 ± 0.10 BOTTOM VIEW—EXPOSED PAD 1.70 ± 0.10 0.75 ±0.05 R = 0.115 TYP R = 0.05 TYP 3.15 REF 1.70 ± 0.05 1 8 16 9 PIN 1 TOP MARK (SEE NOTE 6) 0.200 REF 0.00 – 0.05 (DE16) DFN 0806 REV Ø PIN 1 NOTCH R = 0.20 OR 0.35 45° CHAMFER 3.15 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 2.20 ±0.05 0.70 ±0.05 3.60 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 3.30 ±0.05 3.30 ±0.10 0.45 BSC 0.23 ± 0.05 0.45 BSC DE Package 16-Lead Plastic DFN (4mm × 3mm) (Reference LTC DWG # 05-08-1732 Rev Ø) MS Package 16-Lead Plastic MSOP (Reference LTC DWG # 05-08-1669 Rev Ø) 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 0.889 0.127 (.035 .005) RECOMMENDED SOLDER PAD LAYOUT 0.305 0.038 (.0120 .0015) TYP 0.50 (.0197) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX MSOP (MS16) 1107 REV Ø 0.53 0.152 (.021 .006) SEATING PLANE 0.18 (.007) 1.10 (.043) MAX 0.17 – 0.27 (.007 – .011) TYP 0.86 (.034) REF 0.50 (.0197) BSC 16151413121110 1234567 8 9 0.254 (.010) 0 – 6 TYP DETAIL “A” DETAIL “A” GAUGE PLANE 4.039 0.102 (.159 .004) (NOTE 3) 0.1016 0.0508 (.004 .002) 3.00 0.102 (.118 .004) (NOTE 4) 0.280 0.076 (.011 .003) REF 4.90 0.152 (.193 .006) |
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