APTS030A0X datasheet(21/23 Pages) LINEAGEPOWER

21 / 23 page

Data Sheet

November 11, 2010

12V Mega TLynxTM: Non-Isolated DC-DC Power Modules:

6.0 – 14Vdc Input; 0.8Vdc to 3.63Vdc Output; 30A output current

LINEAGE POWER

Surface Mount Information

Pick and Place

The 12V Mega TLynx

TM SMT modules use an open

frame construction and are designed for a fully

automated assembly process. The modules are fitted

with a label designed to provide a large surface area

for pick and place operations. The label meets all the

requirements for surface mount processing, as well as

safety standards, and is able to withstand reflow

temperatures of up to 300

oC. The label also carries

product information such as product code, serial

number and location of manufacture.

Figure 37. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by

using open frame construction. Even so, these

modules have a relatively large mass when compared

to conventional SMT components. Variables such as

nozzle size, tip style, vacuum pressure and pick &

placement speed should be considered to optimize

this process. The minimum recommended inside

nozzle diameter for reliable operation is 3mm. The

maximum nozzle outer diameter, which will safely fit

within the allowable component spacing, is 5 mm

max.

Tin Lead Soldering

The 12V Mega TLynx

TM SMT power modules are lead

free modules and can be soldered either in a lead-

free solder process or in a conventional Tin/Lead

(Sn/Pb) process. It is recommended that the

customer review data sheets in order to customize the

solder reflow profile for each application board

assembly. The following instructions must be

observed when soldering these units. Failure to

observe these instructions may result in the failure of

or cause damage to the modules, and can adversely

affect long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process

peak reflow temperatures are limited to less than

235

oC. Typically, the eutectic solder melts at 183oC,

wets the land, and subsequently wicks the device

connection. Sufficient time must be allowed to fuse

the plating on the connection to ensure a reliable

solder joint. There are several types of SMT reflow

technologies currently used in the industry. These

surface mount power modules can be reliably

soldered using natural forced convection, IR (radiant

infrared), or a combination of convection/IR. For

reliable soldering the solder reflow profile should be

established by accurately measuring the modules CP

connector temperatures.

100

150

200

250

300

Preheat zo ne

max 4oCs-1

So ak zo ne

30-240s

Heat zo ne

max 4oCs-1

Peak Temp 235oC

Coo ling

zone

1-4oCs-1

lim above

205oC

REFLOW TIME (S)

Figure 38. Reflow Profile for Tin/Lead (Sn/Pb)

process.

200

205

210

215

220

225

230

235

240

1020

4050

Figure 39. Time Limit Curve Above 205

oC Reflow

for Tin Lead (Sn/Pb) process.

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