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33886 Datasheet(PDF) 4 Page - Freescale Semiconductor, Inc |
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33886 Datasheet(HTML) 4 Page - Freescale Semiconductor, Inc |
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4 / 25 page ![]() Analog Integrated Circuit Device Data 4 Freescale Semiconductor 33886 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Rating Symbol Value Unit Supply Voltage V+ 40 V Input Voltage (1) VIN -0.1 to 7.0 V FS Status Output (2) V FS 7.0 V Continuous Current (3) IOUT 5.0 A ESD Voltage for DH Package Human Body Model (4) Machine Model (5) VESD1 VESD2 ±2000 (6) ±200 V ESD Voltage for VW Package Human Body Model (4) Machine Model (5) VESD1 VESD2 ±2000 ±200 V Storage Temperature TSTG -65 to 150 °C Ambient Operating Temperature (7) TA -40 to 125 °C Operating Junction Temperature TJ -40 to 150 °C Peak Package Reflow Temperature During Reflow (8), (9) TPPRT Note 8. °C Approximate Junction-to-Board Thermal Resistance (and Package Dissipation = 6.0 W) (10) RθJB ~5.0 °C/W Notes 1. Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device. 2. Exceeding the pull-up resistor voltage on the open drain FS pin may cause permanent damage to the device. 3. Continuous current capability so long as junction temperature is ≤ 150 °C. 4. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω). 5. ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 6. All pins are capable of Human Body Model ESD voltages of ±2000 V with two exceptions pertaining only to the DH suffix package: (1) D2 to PGND is capable of ±1500 V and (2) OUT1 to AGND is capable of ±1000 V. 7. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking. 8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 10. Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual RθJB (junction-to-PC board) values will vary depending on solder thickness and composition and copper trace. |
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