Document Number: 60076

www.vishay.com

Revision: 24-Feb-11

79

High Power Thin Film Wraparound Chip Resistor

PHP

Vishay Thin Film

PHP series chip resistors are designed with enlarged

backside terminations to reduce the thermal resistance

between the topside resistor layer and the solder joint on the

end users circuit board.

Actual power handling capability is limited by the end user

mounting process. As with any high power chip resistor the

ability to remove the generated heat is critical to the overall

performance of the device.

FEATURES

• High purity ceramic substrate

• Power rating to 2.5 W

• Resistance range 10

 to 30 k

• Resistor tolerance to ± 0.1 %

• TCR to ± 25 ppm/°C

• Flame resistant UL 94 V-0

APPLICATIONS

• Power supplies

• Power switching

• Braking system

• Test and measurement equipment

• Motor deflection circuits

TYPICAL PERFORMANCE

Note

ABSOLUTE

TCR

25

TOL.

0.1

STANDARD ELECTRICAL SPECIFICATIONS

TEST

SPECIFICATIONS

CONDITIONS

Material

Nichrome

-

Resistance Range

10

 to 30 k

-

TCR: Absolute

25 ppm/°C, 50 ppm/°C (stdandard)

and 100 ppm/°C

- 55 °C to + 125 °C

Tolerance: Absolute

0.1 %, 0.5 %, 1.0 % and 5.0 %

+ 25 °C

Power Rating: Resistor

Maximum at + 70 °C

Stability: Absolute

R 0.1 %

2000 h at + 70 °C

Stability: Ratio

Not applicable

-

Voltage Coefficient

< 0.1 ppm/V

-

Working Voltage

1206: 100 V, 2512: 200 V

-

Operating Temperature Range

- 55 °C to + 125 °C

-

Storage Temperature Range

- 55 °C to + 150 °C

-

Noise

< - 30 dB

-

Shelf Life Stability: Absolute

± 0.01 %

1 year at + 25 °C

COMPONENT RATINGS

CASE SIZE

POWER RATING (mW)

WORKING VOLTAGE (V)

RESISTANCE RANGE (

)

1206

100

10 to 30K

2512

200

10 to 30K

ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements)

ENVIRONMENTAL TEST

LIMITS MIL-PRF-55342

CHARACTERISTIC “E”

TYPICAL VISHAY PERFORMANCE

Resistance Temperature Characteristic

± 25 ppm/°C

± 15 ppm/°C

Maximum Ambient Temperature at Rated Wattage

+ 70 °C

+ 70 °C

Maximum Ambient Temperature at Power Derating

+ 150 °C

+ 150 °C

Thermal Shock

± 0.1 %

± 0.04 %

Low Temperature Operation

± 0.1 %

± 0.001 %

Short Time Overload

± 0.1 %

± 0.003 %

High Temperature Exposure

± 0.1 %

± 0.030 %

Resistance to Soldering Heat

± 0.2 %

± 0.007 %

Moisture Resistance

± 0.2 %

± 0.002 %

Life at + 70 °C for 2000 h

± 0.5 %

± 0.100 %