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MIC4100 Datasheet(PDF) 12 Page - MIC GROUP RECTIFIERS |
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MIC4100 Datasheet(HTML) 12 Page - MIC GROUP RECTIFIERS |
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12 / 18 page ![]() Micrel, Inc. MIC4100/1 March 2006 12 M9999-031506 Application Information Power Dissipation Considerations Power dissipation in the driver can be separated into three areas: • Internal diode dissipation in the bootstrap circuit • Internal driver dissipation • Quiescent current dissipation used to supply the internal logic and control functions. Bootstrap Circuit Power Dissipation Power dissipation of the internal bootstrap diode primarily comes from the average charging current of the CB capacitor times the forward voltage drop of the diode. Secondary sources of diode power dissipation are the reverse leakage current and reverse recovery effects of the diode. The average current drawn by repeated charging of the high-side MOSFET is calculated by: frequency switching drive gate V at Charge Gate Total Q : where HB gate ) ( = = × = S S gate AVE F f f Q I The average power dissipated by the forward voltage drop of the diode equals: drop voltage forward Diode V : where F ) ( = × = F AVE F fwd V I Pdiode The value of VF should be taken at the peak current through the diode, however, this current is difficult to calculate because of differences in source impedances. The peak current can either be measured or the value of VF at the average current can be used and will yield a good approximation of diode power dissipation. The reverse leakage current of the internal bootstrap diode is typically 11uA at a reverse voltage of 100V and 125C. Power dissipation due to reverse leakage is typically much less than 1mW and can be ignored. Reverse recovery time is the time required for the injected minority carriers to be swept away from the depletion region during turn-off of the diode. Power dissipation due to reverse recovery can be calculated by computing the average reverse current due to reverse recovery charge times the reverse voltage across the diode. The average reverse current and power dissipation due to reverse recovery can be estimated by: Time Recovery Reverse t Current Recovery Reverse Peak I : where 5 . 0 rr RRM ) ( ) ( = = × = × × × = REV AVE RR RR S rr RRM AVE RR V I Pdiode f t I I The total diode power dissipation is: RR fwd total Pdiode Pdiode Pdiode + = An optional external bootstrap diode may be used instead of the internal diode (Figure 6). An external diode may be useful if high gate charge MOSFETs are being driven and the power dissipation of the internal diode is contributing to excessive die temperatures. The voltage drop of the external diode must be less than the internal diode for this option to work. The reverse voltage across the diode will be equal to the input voltage minus the Vdd supply voltage. A 100V Schottky diode will work for most 72Vinput telecom applications. The above equations can be used to calculate power dissipation in the external diode, however, if the external diode has significant reverse leakage current, the power dissipated in that diode due to reverse leakage can be calculated as: supply power the of frequency switching fs / t Cycle Duty D Voltage Reverse Diode V T and V at flow current Reverse I : where ) 1 ( ON REV J REV R = = = = = − × × = S REV R REV f D V I Pdiode The on-time is the time the high-side switch is conducting. In most power supply topologies, the diode is reverse biased during the switching cycle off-time. |
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