Micrel, Inc.

MIC4223/MIC4224/MIC4225

June 2009

2

M9999-061109-A

(408) 944-0800

Ordering Information

Pin Configuration

8-Pin SOIC (YM)

8-Pin ePAD MSOP (YMME)

8-Pin SOIC (YM)

8-Pin ePAD MSOP (YMME)

8-Pin SOIC (YM)

8-Pin ePAD-MSOP (YMME)

Pin Description

Part Number

Configuration

Junction Temp. Range

Package

Lead Finish

MIC4223YM

Dual Inverting

–40° to +125°C

8-pin SOIC

Pb-Free

MIC4223YMME

Dual Inverting

–40° to +125°C

8-pin EPAD-MSOP

Pb-Free

MIC4224YM

Dual Non-inverting

–40° to +125°C

8-pin SOIC

Pb-Free

MIC4224YMME

Dual Non-inverting

–40° to +125°C

8-pin EPAD-MSOP

Pb-Free

MIC4225YM

Inverting + Non-inverting

–40° to +125°C

8-pin SOIC

Pb-Free

MIC4225YMME

Inverting + Non-inverting

–40° to +125°C

8-pin EPAD-MSOP

Pb-Free

Pin Number

Pin Name

Pin Function

1

ENA

Enable pin for output A. TTL/CMOS-compatible logic input. A logic-level high enables the

device. An internal pull-up enables the part if pin is open. A logic-level low disables the device

and the output will be low regardless of the input state.

2

INA

connect ENA to ground to disable driver A.

3

GND

Ground

4

INB

connect ENB to ground to disable driver B.

5

OUTB

Output B: Parallel Bipolar/CMOS output.

6

VDD

Voltage Supply Input: +4.5V to +18V

7

OUTA

Output A: Parallel Bipolar/CMOS output.

8

ENB

Enable pin for output B. TTL/CMOS-compatible logic input. A logic-level high enables the

device. An internal pull-up enables the part if pin is open. A logic-level low disables the device

and the output will be low regardless of the input state.

EP

GND

Exposed thermal pad for ePad MSOP package only (Not available on SOIC-8L package).

Connect to ground. Must make a full connection to the ground plane to maximize thermal

performance of the package.