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Handling and Assembly Information

CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the

environment. For safety, observe the following procedures:

• Do not ingest.

• Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical

processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.

• Observe government laws and company regulations when discarding this product.This product must be

discarded in accordance with methods specified by applicable hazardous waste procedures.

Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or

systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life

support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain

life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be

reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or

system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic

containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need

careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.

RoHS Compliant Parts - All Mimix products are RoHS compliant unless otherwise specified.

Part Number for Ordering

Description

CF003-01-000X

Where “X” is RoHS compliant die packed in “V” - vacuum release gel packs or

W” - waffle trays

Die Attach: Conductive epoxy or preform die attach is recom-

mended. For preform die attach: Preform: AuSn (80% Au, 20%

Sn); Stage Temperature: 290 ºC, +/-5 ºC; Handling Tool:Tweezers;

Time: 1 min or less.

Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-

stressed); Thermocompression bonding is preferred over

thermosonic bonding. For thermocompression bonding: Stage

Temperature: 250 ºC ; Bond Tip Temperature: 150 ºC; Bonding

Tip Pressure: 18 to 40 gms depending on size of wire.

Ordering Information

GaAs MESFETTransistor

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2008 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

CF003-01

July 2008 - Rev 15-Jul-08

Caution: ESD Sensitive

Appropriate precautions in handling, packaging

and testing devices must be observed.

Proper ESD procedures should be followed when handling this device.