MAX9995 datasheet(2/13 Pages) MAXIM

2 / 13 page

Dual, SiGe, High-Linearity, 1700MHz to 2700MHz

Downconversion Mixer with LO Buffer/Switch

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC ........................................................................-0.3V to +5.5V

LO1, LO2 to GND ...............................................................±0.3V

IFM_, IFD_, IFM_SET, IFD_SET, LOSEL,

LO_ADJ_M, LO_ADJ_D to GND.............-0.3V to (VCC + 0.3V)

RFMAIN, RFDIV, and LO_ Input Power ..........................+20dBm

RFMAIN, RFDIV Current

(RF is DC shorted to GND through balun) ......................50mA

Continuous Power Dissipation (Note 1) ...............................8.8W

Operating Temperature Range (Note 2) .....TC = -40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

DC ELECTRICAL CHARACTERISTICS

(

Typical Application Circuit, no input RF or LO signals applied, VCC = 4.75V to 5.25V, TC = -40°C to +85°C. Typical values are at VCC

= 5.0V, TC = +25°C, unless otherwise noted.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

4.75

5.25

Total supply current

332

380

VCC (pin 16)

VCC (pin 30)

110

IFM+/IFM- (total of both)

Supply Current

ICC

IFD+/IFD- (total of both)

LOSEL Input High Voltage

VIH

LOSEL Input Low Voltage

VIL

0.8

LOSEL Input Current

IIL and IIH

-10

+10

µA

Note 1: Based on junction temperature TJ = TC + (

θJC x VCC x ICC). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a PCB. See the

Applications Information section for details. The junction

temperature must not exceed +150°C.

Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

TQFN

Junction-to-Ambient Thermal Resistance (

θJA)

(Note 3, 4) ....................................................................38°C/W

Junction-to-Case Thermal Resistance (

θJC)

(Note 1, 4) ...................................................................7.4°C/W

PACKAGE THERMAL CHARACTERISTICS

Note 3: Junction temperature TJ = TA + (

θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

RECOMMENDED AC OPERATING CONDITIONS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

RF Frequency Range

fRF

(Note 5)

1700

2700

MHz

LO Frequency Range

fLO

(Note 5)

1400

2600

MHz

IF Frequency Range

fIF

(Note 5)

350

MHz

LO Drive Level

PLO

(Note 5)

-3

dBm

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