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BFP620 Datasheet(PDF) 2 Page - Infineon Technologies AG |
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BFP620 Datasheet(HTML) 2 Page - Infineon Technologies AG |
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2 / 11 page ![]() 2010-09-21 2 BFP620 Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage TA > 0 °C TA ≤ 0 °C VCEO 2.3 2.1 V Collector-emitter voltage VCES 7.5 Collector-base voltage VCBO 7.5 Emitter-base voltage VEBO 1.2 Collector current IC 80 mA Base current IB 3 Total power dissipation1) TS ≤ 95 °C Ptot 185 mW Junction temperature TJ 150 °C Ambient temperature TA -65 ... 150 Storage temperature TStg -65 ... 150 1TS is measured on the emitter lead at the soldering point to pcb Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) RthJS ≤ 300 K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collector-emitter breakdown voltage IC = 1 mA, IB = 0 V(BR)CEO 2.3 2.8 - V Collector-emitter cutoff current VCE = 7.5 V, VBE = 0 VCE = 5 V, VBE = 0 ICES - - - 0.001 10 0.04 µA Collector-base cutoff current VCB = 5 V, IE = 0 ICBO - 1 40 nA Emitter-base cutoff current VEB = 0.5 V, IC = 0 IEBO - 10 900 DC current gain IC = 50 mA, VCE = 1.5 V, pulse measured hFE 110 180 270 - 1For calculation of RthJA please refer to Application Note AN077 Thermal Resistance |
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