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IMX53CEC Datasheet(PDF) 201 Page - Freescale Semiconductor, Inc |
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IMX53CEC Datasheet(HTML) 201 Page - Freescale Semiconductor, Inc |
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201 / 204 page ![]() Revision History i.MX53xD Applications Processors for Consumer Products, Rev. 2 Freescale Semiconductor 201 7 Revision History Table 121 provides a revision history for this data sheet. Table 121. i.MX53xD Data Sheet Document Revision History Rev. Number Date Substantive Change(s) Rev 2 05/2011 • In Table 1, "Ordering Information," on page 3, deleted the row for part number PCIMX535DVV1B, added a row for MCIMX538DZK1C and updated the PCIMX538DZK1C row. • Updated the note on page 6 in Section 1.2, “Features.” • Added 167 MHz ARM specification to Table 7, "i.MX53xD Operating Ranges," on page 20. • Modified VDD_FUSE design best practice footnote on Table 7, "i.MX53xD Operating Ranges," on page 20. • Changed VDD_FUSE max current to 120 mA in Table 9, "Maximal Supply Currents," on page 23. • Deleted the last row of Table 10, "USB Interface Current Consumption," on page 25. • Added Section 4.1.2.2, “PoP Package Thermal Resistance,” according to package design report. • Made changes related to text, tables, and figures in Section 4.6.7, “DDR SDRAM Specific Parameters (DDR2/LVDDR2, LPDDR2, and DDR3). Changes include adding LPDDR2 waves, updating timings by ACCZ test results, and changing note about DDR load model. • Removed the Standard Serial Interfaces section. •In Table 11, "GPIO I/O DC Electrical Characteristics," on page 29, changed input current with no pull-up/down from 250/120 nA to 2 μA, all input currents with pull-up from 0.12 μΑ to 2 μA when Vin = OVDD, and input current with pull-down from 0.25 μA to 2 μA when Vin = 0. •In Table 12, Table 13, and Table 14, changed input current from the nA range to 1 μA. •In Table 15, "LVIO DC Electrical Characteristics," on page 33, changed input current with no pull-up/down from 250/120 nA to 1 μA, all input currents with pull-up from 0.12 μΑ to 1 μA when Vin = OVDD, and input current with pull-down from 0.25 μA to 1 μA when Vin = 0. •In Table 16, "UHVIO DC Electrical Characteristics," on page 34, changed input current with no pull-up/down from 300/63 nA to 1 μA, all input currents with pull-up from 0.06 μΑ to 1 μA when Vin = OVDD, and input current with pull-down from 0.3 μA to 1 μA when Vin = 0. • Updated keeper values in Table 11 through Table 16. • Fixed titles of Figure 18 through Figure 26, to fit original EIM AC spec. • Updated Figure 2, "Power Up Detailed Sequence," on page 27. • Added Figure 27, "DTACK Write Access (DAP=0)," on page 62. • Added Table 19, "DDR Output Driver Average Impedance," on page 38. • Deleted the second footnote of Table 33, "CAMP Electrical Parameters (CKIH1, CKIH2)," on page 47. • Deleted the Revision 1.0 EIM Internal Module Multiplexing table. • Deleted the CKIL Electrical Specifications table. • Deleted the CSPI Slave Mode Timing Parameters table . • Updated the last paragragh of Section 4.7.8.6.1, “IPU Display Operating Signals.” • Changed the title of the Section 4.4.2, “DDR Output Driver Average Impedance,” from “LPDDR2 I/O Output Buffer Impedance.” • Added Section 6.3.2.2, “PoP Memory Support and Signal Cross Reference.” • Updated Table 36, " NFC—Timing Characteristics," on page 52. • Removed the “Differential pulse skew” row from Table 30, "AC Electrical Characteristics of LVDS Pad," on page 45. • Updated Table 64, "Asynchronous Display Interface Timing Parameters (Pixel Level)," on page 105. • Updated Table 65, "Asynchronous Parallel Interface Timing Parameters (Access Level)," on page 106. • Updated Table 101, "USB Timing Specification for Normal ULPI Mode," on page 144. • Updated the second footnote on Table 112, "19 x 19 mm Signal Assignments, Power Rails, and I/O," on page 154. |
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