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IMX53CEC Datasheet(PDF) 201 Page - Freescale Semiconductor, Inc

Part # IMX53CEC
Description  Applications Processors for Consumer Products
PDF  204 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

IMX53CEC Datasheet(HTML) 201 Page - Freescale Semiconductor, Inc

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Revision History
i.MX53xD Applications Processors for Consumer Products, Rev. 2
Freescale Semiconductor
201
7
Revision History
Table 121 provides a revision history for this data sheet.
Table 121. i.MX53xD Data Sheet Document Revision History
Rev.
Number
Date
Substantive Change(s)
Rev 2
05/2011
• In Table 1, "Ordering Information," on page 3, deleted the row for part number PCIMX535DVV1B,
added a row for MCIMX538DZK1C and updated the PCIMX538DZK1C row.
• Updated the note on page 6 in Section 1.2, “Features.”
• Added 167 MHz ARM specification to Table 7, "i.MX53xD Operating Ranges," on page 20.
• Modified VDD_FUSE design best practice footnote on Table 7, "i.MX53xD Operating Ranges," on
page 20.
• Changed VDD_FUSE max current to 120 mA in Table 9, "Maximal Supply Currents," on page 23.
• Deleted the last row of Table 10, "USB Interface Current Consumption," on page 25.
• Added Section 4.1.2.2, “PoP Package Thermal Resistance,” according to package design report.
• Made changes related to text, tables, and figures in Section 4.6.7, “DDR SDRAM Specific
Parameters (DDR2/LVDDR2, LPDDR2, and DDR3). Changes include adding LPDDR2 waves,
updating timings by ACCZ test results, and changing note about DDR load model.
• Removed the Standard Serial Interfaces section.
•In Table 11, "GPIO I/O DC Electrical Characteristics," on page 29, changed input current with no
pull-up/down from 250/120 nA to 2
μA, all input currents with pull-up from 0.12 μΑ to 2 μA when
Vin = OVDD, and input current with pull-down from 0.25
μA to 2 μA when Vin = 0.
•In Table 12, Table 13, and Table 14, changed input current from the nA range to 1
μA.
•In Table 15, "LVIO DC Electrical Characteristics," on page 33, changed input current with no
pull-up/down from 250/120 nA to 1
μA, all input currents with pull-up from 0.12 μΑ to 1 μA when
Vin = OVDD, and input current with pull-down from 0.25
μA to 1 μA when Vin = 0.
•In Table 16, "UHVIO DC Electrical Characteristics," on page 34, changed input current with no
pull-up/down from 300/63 nA to 1
μA, all input currents with pull-up from 0.06 μΑ to 1 μA when Vin
= OVDD, and input current with pull-down from 0.3
μA to 1 μA when Vin = 0.
• Updated keeper values in Table 11 through Table 16.
• Fixed titles of Figure 18 through Figure 26, to fit original EIM AC spec.
• Updated Figure 2, "Power Up Detailed Sequence," on page 27.
• Added Figure 27, "DTACK Write Access (DAP=0)," on page 62.
• Added Table 19, "DDR Output Driver Average Impedance," on page 38.
• Deleted the second footnote of Table 33, "CAMP Electrical Parameters (CKIH1, CKIH2)," on page
47.
• Deleted the Revision 1.0 EIM Internal Module Multiplexing table.
• Deleted the CKIL Electrical Specifications table.
• Deleted the CSPI Slave Mode Timing Parameters table .
• Updated the last paragragh of Section 4.7.8.6.1, “IPU Display Operating Signals.”
• Changed the title of the Section 4.4.2, “DDR Output Driver Average Impedance,” from “LPDDR2
I/O Output Buffer Impedance.”
• Added Section 6.3.2.2, “PoP Memory Support and Signal Cross Reference.”
• Updated Table 36, " NFC—Timing Characteristics," on page 52.
• Removed the “Differential pulse skew” row from Table 30, "AC Electrical Characteristics of LVDS
Pad," on page 45.
• Updated Table 64, "Asynchronous Display Interface Timing Parameters (Pixel Level)," on page
105.
• Updated Table 65, "Asynchronous Parallel Interface Timing Parameters (Access Level)," on page
106.
• Updated Table 101, "USB Timing Specification for Normal ULPI Mode," on page 144.
• Updated the second footnote on Table 112, "19 x 19 mm Signal Assignments, Power Rails, and
I/O," on page 154.



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