DIP Switches

End Stackable DIP Switches

DX5 Series

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4

13

Resistance

Low

Temperature

Following the test set forth below the

sample shall be left in normal temperature

and humidity conditions for an hour

before measurements are made :

1)Temperature : -40

±3

2)Time: 96 hours

As shown in item 2~6

14

Resistance

High

Temperatur

e

F

ollowing the test set forth below the

sample shall be left in normal temperature

and humidity conditions for an hour

before measurements are made :

1)Temperature : 85

±2

2)Time: 96 hours

1)As shown in item 3~6

2)Contact Resistance:

100m

max.

Humidity

Following the test set forth below the sample

shall be left in normal temperature and

humidity conditions for an hour before

measurements are made :

1)Temperature : 40

±2

2)Relative Humidity :90~95%

3)Time: 96 hours

1)As shown in item 4,6

2)Contact Resistance:

100m

max.

3)Insulation Resistance:

10M

min.

5. SOLDERING CONDITIONS:

Condition for Soldering – SMT Terminals

The condition mentioned above is the temperature on the Cu foil of the P.C.B surface.

There are cases where board’s temperature greatly differs from switch’s surface

temperature depending on board’s material, size, thickness, etc.

Care, therefore,

should be used not to allow switch’s surface temperature to exceed 260

.

Manual Soldering

(THT Terminals)

Soldering Temperature

Max.350

Continuous Soldering Time

Max. 5 seconds

Precautions in Handling

1. Care should be exercised so that flux from the upper part of the printed

circuit board does not adhere to the switch.

2. Don’t clean the switch body except with top tape sealed type, which can

only spray of cleaning method from top of s/w.

3. Please make sure that there is no flux rose over the surface of the PCB

Temperature

Room

150°

MAX 260°

60sec

120~150sec

TIME(sec)

255°

230°

5~10sec