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ARF475FL Datasheet(PDF) 1 Page - Microsemi Corporation |
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ARF475FL Datasheet(HTML) 1 Page - Microsemi Corporation |
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1 / 4 page ![]() MAXIMUM RATINGS All Ratings: T C = 25°C unless otherwise specified. STATIC ELECTRICAL CHARACTERISTICS (each device) Symbol BV DSS V DS(ON) I DSS I GSS g fs g fs1 / gfs2 V GS(TH) DV GS(TH) Characteristic / Test Conditions Drain-Source Breakdown Voltage (V GS = 0V, ID = 250 μA) On State Drain Voltage 1 (I D(ON) = 5A, VGS = 10V) Zero Gate Voltage Drain Current (V DS = VDSS, VGS = 0V) Zero Gate Voltage Drain Current (V DS = 50V, VGS = 0, TC = 125°C) Gate-Source Leakage Current (V GS = ±30V, VDS = 0V) Forward Transconductance (V DS = 15V, ID = 5A) Forward Transconductance Match Ratio (V DS = 15V, ID = 5A) Gate Threshold Voltage (V DS = VGS, ID = 200mA) Gate Threshold Voltage Match (V DS = VGS, ID = 200mA) MIN TYP MAX 500 2.9 4 100 500 ±100 3 3.6 0.9 1.1 2 3.3 4 0.2 UNIT Volts μA nA mhos Volts Symbol V DSS V DGO I D V GS P D T J,TSTG T L Parameter Drain-Source Voltage Drain-Gate Voltage Continuous Drain Current @ T C = 25°C (each device) Gate-Source Voltage Total Device Dissipation @ T C = 25°C Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec. ARF475FL 500 500 10 ±30 910 -55 to 175 300 UNIT Volts Amps Volts Watts °C RF POWER MOSFET N - CHANNEL PUSH - PULL PAIR 165V 450W 150MHz The ARF475FL is a matched pair of RF power transistors in a common source configuration. It is designed for high voltage push-pull or parallel operation in narrow band ISM and MRI power amplifiers up to 150 MHz. • Specified 150 Volt, 128 MHz Characteristics: • Output Power = 900 Watts Peak • Gain = 15dB (Class AB) • Efficiency = 50% min • High Performance Push-Pull RF Package. • High Voltage Breakdown and Large SOA for Superior Ruggedness. • Low Thermal Resistance. • RoHS Compliant * ARF475FL Common Source Push-Pull Pair CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. THERMAL CHARACTERISTICS Symbol R θJC R θJHS Characteristic Junction to Case Junction to Sink (Use High Efficiency Thermal Grease and Planar Heat Sink Surface.) MIN TYP MAX 0.15 0.165 0.30 0.33 UNIT °C/W G G D S S S S D Microsemi Website - http://www.microsemi.com *Pb Free Terminal Finish. |
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