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LCC Datasheet(PDF) 2 Page - HolyStone International |
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LCC Datasheet(HTML) 2 Page - HolyStone International |
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2 / 2 page ![]() Dimensions Capacitance Range TYPE L W T (max) B (min) BW (min) 1515 3.80 ±0.50 [.15 ±.020] 3.80 ±0.50 [.15 ±.020] 3.20 [.126] 1.60 [.059] 0.30 [.012] 2520 6.35 ±0.50 [.25 ±.020] 5.00 ±0.50 [.20 ±.020] 3.20 [.126] 4.00 [.157] 0.30 [.012] 3530 8.90 ±0.50 [.35 ±.020] 7.60 ±0.50 [.30 ±.020] 5.00 [.200] 5.50 [.217] 0.30 [.012] 3640 9.20 ±0.50 [.36 ±.020] 10.2 ±0.50 [.40 ±.020] 5.00 [.200] 6.00 [.236] 0.30 [.012] 4540 11.5 ±0.50 [.45 ±.020] 10.2 ±0.50 [.40 ±.020] 5.00 [.200] 7.50 [.295] 0.30 [.012] 5550 14.0 ±0.50 [.55 ±.020] 12.7 ±0.50 [.50 ±.020] 5.00 [.200] 9.00 [.354] 0.30 [.012] 6560 16.5 ±0.50 [.65 ±.020] 15.3 ±0.50 [.60 ±.020] 5.00 [.200] 11.50 [.453] 0.30 [.012] 7565 19.0 ±0.50 [.750 ±.020] 16.5 ±0.50 [.65 ±.020] 5.00 [.200] 14.00 [.551] 0.30 [.012] Unit : mm [inches] All values are capacitance EIA codes. Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. LCC Series-Large Size Multilayer Ceramic Chip Capacitors 50V 100V 200V 500V 1KV 2KV 3KV 4KV 5KV 8KV NPO 473 393 363 103 222 821 X7R 225 105 474 124 473 682 NPO 823 683 563 473 103 392 222 102 471 X7R 475 225 474 224 473 153 472 222 102 NPO 154 134 104 823 253 103 472 332 102 471 X7R 106 475 225 824 224 473 183 822 472 102 NPO 224 184 124 104 373 153 562 362 122 561 X7R 126 565 225 105 274 683 273 153 103 182 NPO 284 244 184 154 483 203 962 472 152 621 X7R 156 685 225 125 394 104 393 223 153 392 NPO 364 304 224 184 683 273 153 562 182 681 X7R 186 825 275 225 474 124 823 333 223 562 NPO 654 484 404 304 104 423 223 682 332 821 X7R 226 186 106 335 105 224 104 563 333 103 NPO 844 674 504 474 134 553 283 103 472 102 X7R 336 226 186 475 125 364 154 823 473 153 6560 7565 Capacitance maximum 3530 3640 4540 5550 2520 1515 Dielectric Size W T BW B L *Soldering and handling precautions: Large ceramic capacitors are more prone to thermal and mechanical cracks. To minimize mechanical cracks, capacitors have to be handled carefully in the original waffle pack container, carrier tape or other suitable container. Care must be taken that ceramic chips do not come into contact with one another causing chip outs, cracks or other mechanical damage. The recommended method for soldering large chips is reflow soldering. Wave soldering and manual soldering are not recommended. Ceramic capacitors should be preheated to within 50 °C of the peak soldering temperature and then use a maximum 2°C/second ramp rate for both heating and cooling. A sudden increase or decrease in temperature during soldering may cause internal thermal cracks. Available Options: • HEC offers flexible termination (Super Term) for very large chips to minimize mechanical cracks due to board flexing. • To minimize the potential for surface arcing in higher voltage applications, HEC offers the option of a proprietary surface coating. • Pure tin terminated / ROHS compliant products are offered as standard, however, lead (Pb) content plated termination is also available. • Pd/Ag termination is also available as an option for hybrid circuits and other applications. - 31 - |
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