MAX13301 datasheet(2/37 Pages) MAXIM

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4-Channel, Automotive Class D Audio Amplifier

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PVDD to PGND......................................................-0.3V to +30V

PVDD to PGND (t < 200ms)..................................-0.3V to +50V

PVDD Ramp Rate ........................................................... 25V/ms

VDD5, CM to PGND.................................................-0.3V to +6V

CP to PGND ........................(VPVDD - 0.3V) to (VCHOLD + 0.3V)

CHOLD to PVDD .....................................................-0.3V to +6V

OUT_ to PGND, FB_ to PGND ..............-0.3V to (VPVDD + 0.3V)

VDD to GND............................................................-0.3V to +6V

REF to GND.............................................................-0.3V to +6V

SCL, SDA, SYNC to GND........................................-0.3V to +6V

MUTE_CL1, CL0, FLT_OT, EN to GND...................-0.3V to +6V

IN_ to GND..............................................................-0.3V to +6V

GND to PGND ......................................................-0.3V to +0.3V

Continuous Power Dissipation (Notes 1 and 2)

TSSOP (derate 16.7mW/NC above 70NC)...............1333.3mW

Operating Temperature Range........................ -40NC to +125NC

Junction Temperature Range........................... -40NC to +150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+240NC

TSSOP

Junction-to-Ambient Thermal Resistance (BJA) ..........60NC/W

Junction-to-Case Thermal Resistance (BJC) .................1NC/W

ELECTRICAL_CHARACTERISTICS

(VPVDD = 14.4V, VDD = VDD5 = 5V, VGND = VPGND = 0V, fSW = 500kHz, MAP.COMP[2:0] = (see Table 20 for applicable setting),

TA = -40NC to +125NC; typical values are at TA = +25NC, unless otherwise noted.) (Note 3)

ABSOLUTE_MAXIMUM_RATINGS

PACKAGE_THERMAL_CHARACTERISTICS_(Notes_1_and_2)

Note_1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note_2: The 48-pin TSSOP-EPR package has a top side exposed pad for enhanced thermal management. Connect this exposed

pad to an external heatsink to ensure the device is adequately cooled. The maximum power dissipation in the device is a

function of this external heatsink and other system parameters. See the Thermal Information section for more information.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

AMPLIFIER_DC_CHARACTERISTICS

Supply Voltage Range

VPVDD

25.5

Operational

VDD5

4.75

5.5

VDD

4.5

5.5

PVDD UVLO Threshold

Falling

5.2

5.35

5.6

PVDD OVLO Threshold

Rising

PVDD OVLO Response Timing

Rising

OUT_ and FB_ Voltage

OV active

VPVDD/2

VDD UV Threshold

Falling

4.2

4.35

Rising

4.5

4.6

VDD UV Threshold Hysteresis

0.1

0.2

VDD UV Threshold Deglitch

Quiescent Supply Current

IPVDD

RL = J

, play mode (CTRL2 = 0x0F)

IVDD5

IVDD

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