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MAX9643

60V High-Speed Precision Current-Sense Amplifier

RS+ to GND, RS- to GND (Note 1) .......................-3.5V to +65V

RS+ to RS-.......................................................................... Q15V

VCC to GND...........................................................-0.3V to +40V

VCC > 4.5V

OUT to GND .....................................................-0.3V to +4.5V

VEE to GND ......................................................+0.3V to -4.5V

CP1 to GND......................................................-0.3V to +4.5V

VCC ≤ 4.5V

OUT to GND ......................................... -0.3V to (VCC + 0.3V)

VEE to GND ........................................ +0.3V to (-VCC + 0.3V)

CP1 to GND.......................................... -0.3V to (VCC + 0.3V)

CP2 to GND ............................................. (VEE - 0.3V) to +0.3V

Short-Circuit Duration................................................Continuous

Continuous Input Current into Any Pin............................ Q20mA

ESD on RS+, RS- .......................................................Q4kV HBM

ESD on All Other Pins ................................................Q2kV HBM

Maximum Power Dissipation

TDFN-EP (derate 16.7mW/NC at +70NC) ................1333.3mW

Operating Temperature Range........................ -40NC to +125NC

Junction Temperature .....................................................+150NC

Lead Temperature (10s, soldering) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

TDFN

Junction-to-Ambient Thermal Resistance (BJA)......... 60NC/W

Junction-to-Case Thermal Resistance (BJC) .............. 11NC/W

ABSOLUTE MAXIMUM RATINGS

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 2)

ELECTRICAL CHARACTERISTICS

(VCC = 5V, VRS+ = VRS- = 12V, TA = -40NC to +125NC, unless otherwise noted.) (Note 3)

Note 1: Voltages below -3.5V are allowed, as long as the input current is limited to 5mA by an external resistor.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

Input Common-Mode Voltage

Range

VRS+, VRS-

VCC R 5V, guaranteed by CMRR test,

VSENSE P 100mV

-1.5

+60

VCC < 5V, guaranteed by CMRR test,

VSENSE P 100mV

3.5 -

VCC

Input Offset Voltage (Notes 4, 5)

VOS

TA = +25NC

-40NC < TA <+125NC

400

Common-Mode Rejection Ratio

(Note 5)

CMRR

-1.5V P VCM P 60V, TA = +25NC

120

130

-1.5V P VCM P 60V, -40NC P TA P +125NC

110

CMRR vs. Frequency (Note 5)

AC CMRR f = 100kHz

Input Bias Current

IRS+, IRS-

TA = +25NC

-40NC < TA < +125NC

Input Bias Current, VCC = 0V,

VRS+ = VRS- = 60V

IRS+, IRS

Input Offset Current (Note 6)

IRS+ - IRS-

TA = +25NC

0.02

0.15

-40NC < TA < +125NC

0.3

Maximum Sense Voltage Before

Input Saturation

VCM < 2V

100

VCM R 2V

MAX9643T

400

MAX9643U

300

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