For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

8

8 - 130

Pin Number

Function

Description

Interface Schematic

1, 5 - 8, 12, 13

N/C

No connection necessary.

These pins may be connected to RF/DC ground.

2, 4, 9, 11, 15

GND

These pins must be connected to RF/DC ground.

3

RF IN

This pin is AC coupled and matched to 50 Ohms.

10

RF OUT

This pin is AC coupled and matched to 50 Ohms.

14

Vdd

Power supply voltage.

16

Vctl

Control voltage. Vctl= Vdd for LNA mode.

Vctl= 0V for bypass mode.

Pin Descriptions

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.

GaAs MMIC LOW NOISE AMPLIFIER

w/ BYPASS MODE, 3.4 - 3.8 GHz

v03.1206

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC491LP3

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

491

XXXX

HMC491LP3E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

491

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information