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MIC28500 Datasheet(PDF) 9 Page - Micrel Semiconductor

Part # MIC28500
Description  75V/4A Hyper Speed Control??Synchronous DC-DC Buck Regulator
PDF  29 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC28500 Datasheet(HTML) 9 Page - Micrel Semiconductor

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Micrel, Inc.
MIC28500
June 2011
9
M9999-060311-B
Typical Characteristics (Continued)
Die Temperature* (VIN = 30V)
vs. Output Current
0
20
40
60
80
012
34
OUTPUT CURRENT (A)
VIN = 30V
VOUT = 3.3V
VDD= 5V
fSW = 250kHz
Die Temperature* (VIN = 48V)
vs. Output Current
0
20
40
60
80
01
23
4
OUTPUT CURRENT (A)
VIN = 48V
VOUT = 3.3V
VDD= 5V
fSW = 250kHz
Die Temperature* (VIN = 75V)
vs. Output Current
0
20
40
60
80
100
01
23
4
OUTPUT CURRENT (A)
VIN = 75V
VOUT = 3.3V
VDD = 5V
fSW = 250kHz
Efficiency (VIN = 30V)
vs. Output Current
30
40
50
60
70
80
90
100
01
23
456
OUTPUT CURRENT (A)
5.0V
3.3V
2.5V
1.8V
1.5V
1.2V
1.0V
0.9V
0.8V
VIN = 30V
fSW = 250kHz
Efficiency (VIN = 48V)
vs. Output Current
10
20
30
40
50
60
70
80
90
100
012
3456
OUTPUT CURRENT (A)
5.0V
3.3V
2.5V
1.8V
1.5V
1.2V
1.0V
0.9V
0.8V
VIN = 48V
fSW = 250kHz
Efficiency (VIN = 75V)
vs. Output Current
10
20
30
40
50
60
70
80
90
100
0
12
3456
OUTPUT CURRENT (A)
5.0V
3.3V
2.5V
1.8V
1.5V
1.2V
1.0V
0.9V
0.8V
VIN = 75V
fSW = 250kHz
Thermal Derating
0
1
2
3
4
25
40
55
70
85
100
Maximum Ambient Temperature (°C)
VIN = 48V
fSW=250kHz
L=10uH
Tj_MAX =125°C
VOUT = 5V
VOUT = 3.3V
VOUT = 2.5V
Thermal Derating
0
1
2
3
4
25
40
55
70
85
100
Maximum Ambient Temperature (°C)
VIN = 48V
fSW=250kHz
L=10uH
Tj_MAX =125°C
VOUT = 1.2V
VOUT = 0.8V
Thermal Derating
0
1
2
3
4
25
40
55
70
85
100
Maximum Ambient Temperature (°C)
VIN = 48V
VOUT = 12V
fSW=250kHz
L=33μH
Tj_MAX =125°C
Die Temperature* :
The temperature measurement was taken at the hottest point on the MIC28500 case mounted on a 5 square inch 4 layer, 0.62”,
FR-4 PCB with 2oz. finish copper weight per layer, see Thermal Measurement section. Actual results will depend upon the size of the PCB, ambient
temperature and proximity to other heat emitting components.



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