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HMC983LP5E

v00.0911

DC - 7 GHZ FRACTIONAL-N DIVIDER

AND FREQUENCY SWEEPER

For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

978-250-3343 tel • 978-250-3373 fax • Order On-line at www.hittite.com

Application Support: apps@hittite.com

Outline Drawing

Part Number

Package Body Material

Lead Finish

HMC983LP5E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

H983

XXXX

[1] 4-Digit lot number XXXX

[2] Max peak reflow temperature of 260 °C

Package Information

Table 3. Absolute Maximum Ratings

Nominal 3V Supplies to GND

-0.3 to 3.6 V

Nominal 3V Digital Supply to 3V

Analog Supply

-0.3 to +0.3 V

Nominal 5V Supply to GND (VPPBUF) -0.3 to 5.5 V

divCkp, divCkn common mode DC

VCCPS + 0.5 V min

VCOIP, VCOIN Single Ended AC 50 Ω

Source

+ 7 dBm

VCOIP, VCOIN Differential AC 50 Ω

Source

+ 13 dBm

Digital Input Voltage Range

-0.25 to DVDD + 0.5 V

Minimum Digital Load

1 kΩ

Operating Temperature Range

-40 °C to +85 °C

Maximum Junction Temperature

125 °C

Storage Temperature

-65 to +125 °C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Thermal Resistance (Rth)

(junction to ground paddle)

40 °C/W

Reflow Soldering

Peak Temperature

Time at Peak Temperature

260 °C

40 s

ESD Sensitivity (HBM)

Class 1B

Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions

above those indicated in the operational section of this specification

is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

NOTES:

[1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC

SILICA AND SILICON IMPREGNATED.

[2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

[3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

[4] DIMENSIONS ARE IN INCHES [MILLIMETERS].

[5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

[6] PAD BURR LENGTH SHALL BE 0.15 mm MAX. PAD BURR HEIGHT SHALL BE

0.25 m MAX.

[7] PACKAGE WARP SHALL NOT EXCEED 0.05 mm

[8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB

RF GROUND.

[9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND

PATTERN.