I

SOURCE

VBAT

GND

C

B

A

2

1

NanoFree PACKAGE

(BOTTOM VIEW)

I

SINK

SCL

SDA

DRV201

SLVSB25

– AUGUST 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE PART NUMBER

-40

°C to 85°C

YFM

DRV201YFMR

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

DEVICE INFORMATION

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

NO.

VBAT

2A

Power

GND

1A

Ground

I_SOURCE

2B

Voice coil positive terminal

I_SINK

1B

Voice coil negative terminal

SCL

2C

I

SDA

1C

I/O

2

Copyright

© 2011, Texas Instruments Incorporated