Introduction to Circuit Protection

Introduction to Circuit Protection

Transientology

2

© 2009 Littelfuse, Inc.

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/804.html for current information.

TE-UMF 804 Series

Universal Modular Fuses

TE > Time Lag > 804 Series

Average Time Current Curves

Temperature Rerating Curve

Soldering Parameters - Wave Soldering

Dwell Time

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

300

Time (Seconds)

Cooling Time

Preheat Time

Wave Parameter

Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

Temperature Minimum:

100

Temperature Maximum:

150

Preheat Time:

60-180 seconds

Solder PotTemperature:

260

Solder DwellTime:

2-5 seconds

Recommended Hand-Solder Parameters:

Solder Iron Temperature: 350° C +/- 5°C

Note: These devices are not recommended for IR or

Convection Reflow process.

Recommended Process Parameters:

0%

20%

40%

60%

80%

100%

120%

140%

-55

-30

-5

20

45

70

95

120

AMBIENT TEMPERATURE (°C)

804 DE-RATING CURVE

CURRENT [A]

0.1

1

10

100

1000

0.010

0.001

0.100

1.000

10.000

100.000

1000.000