AM1808 datasheet(256/262 Pages) TI

256 / 262 page

AM1808

SPRS653C

– FEBRUARY 2010 – REVISED DECEMBER 2011

www.ti.com

Mechanical Packaging and Orderable Information

This section describes the device orderable part numbers, packaging options, materials, thermal and

mechanical parameters.

7.1

Thermal Data for ZCE Package

The following table(s) show the thermal resistance characteristics for the PBGA

–ZCE mechanical

package.

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

Junction-to-case

7.6

N/A

ΘJB

Junction-to-board

11.3

N /A

ΘJA

Junction-to-free air

23.9

0.00

21.2

0.50

20.3

1.00

ΘJMA

Junction-to-moving air

19.5

2.00

18.6

4.00

0.2

0.00

0.3

0.50

PsiJT

Junction-to-package top

0.3

1.00

0.4

2.00

0.5

4.00

11.2

0.00

11.1

0.50

PsiJB

Junction-to-board

11.1

1.00

11.0

2.00

10.9

4.00

(1)

These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.

For more information, see these EIA/JEDEC standards

– EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment

Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount

Packages. Power dissipation of 500 mW and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness

and 1.5oz (50um) inner copper thickness

(2)

m/s = meters per second

7.2

Thermal Data for ZWT Package

The following table(s) show the thermal resistance characteristics for the PBGA

–ZWT mechanical

package.

Table 7-2. Thermal Resistance Characteristics (PBGA Package) [ZWT]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

Junction-to-case

7.3

N/A

ΘJB

Junction-to-board

12.4

N /A

ΘJA

Junction-to-free air

23.7

0.00

(1)

These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.

For more information, see these EIA/JEDEC standards

– EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment

Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount

Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and

1.5oz (50um) inner copper thickness

(2)

m/s = meters per second

256

Mechanical Packaging and Orderable Information

Submit Documentation Feedback

Product Folder Link(s): AM1808

AM1808 Datasheet(PDF) 256 Page - Texas Instruments

AM1808 Datasheet(HTML) 256 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL