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CSD25302Q2 Datasheet(PDF) 2 Page - Texas Instruments

Part # CSD25302Q2
Description  P-Channel NexFET??Power MOSFET
PDF  9 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

CSD25302Q2 Datasheet(HTML) 2 Page - Texas Instruments

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CSD25302Q2
SLPS234A – NOVEMBER 2009 – REVISED OCTOBER 2010
www.ti.com
ELECTRICAL CHARACTERISTICS
TA = 25°C, unless otherwise specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Static Characteristics
BVDSS
Drain to Source Voltage
VGS = 0V, IDS = –250mA
–20
V
IDSS
Drain to Source Leakage
VGS = 0V, VDS = –16V
–1
mA
IGSS
Gate to Source Leakage
VDS = 0V, VGS = ±8V
–100
nA
VGS(th)
Gate to Source Threshold Voltage
VDS = VGS, IDS = –250mA
–0.5
–0.65
–0.9
V
VGS = –1.8V, IDS = –3.0A
71
92
m
RDS(on)
Drain to Source On Resistance
VGS = –2.5V, IDS = –3.0A
56
70
m
VGS = –4.5V, IDS = –3.0A
39
49
m
gfs
Transconductance
VDS = –10V, IDS = –3.0A
12.3
S
Dynamic Characteristics
CISS
Input Capacitance
270
350
pF
COSS
Output Capacitance
VGS = 0V, VDS = –10V, f = 1MHz
120
150
pF
CRSS
Reverse Transfer Capacitance
40
55
pF
Qg
Gate Charge Total (–4.5V)
2.6
3.4
nC
Qgd
Gate Charge – Gate to Drain
0.5
nC
VDS = –10V, IDS = –3.0A
Qgs
Gate Charge Gate to Source
0.54
nC
Qg(th)
Gate Charge at Vth
0.2
nC
QOSS
Output Charge
VDS = –13V, VGS = 0V
2.3
nC
td(on)
Turn On Delay Time
3.2
ns
tr
Rise Time
13.2
ns
VDS = –10V, VGS = –4.5V, IDS = –3.0A, RG = 2Ω
td(off)
Turn Off Delay Time
8.6
ns
tf
Fall Time
1.3
ns
Diode Characteristics
VSD
Diode Forward Voltage
IDS = –3.0A, VGS = 0V
–0.8
–1.0
V
Qrr
Reverse Recovery Charge
2.5
nC
Vdd= –13V, IF = –3.0A, di/dt = 300A/ms
trr
Reverse Recovery Time
8.8
ns
THERMAL CHARACTERISTICS
TA = 25°C, unless otherwise specified
PARAMETER
MIN
TYP
MAX
UNIT
RqJC
Thermal Resistance Junction to Case(1)
8.6
°C/W
RqJA
Thermal Resistance Junction to Ambient(1)(2)
66
°C/W
(1)
RqJC is determined with the device mounted on a 1-inch
2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm ×
3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RqJC is specified by design, whereas RqJA is determined by the user’s board design.
(2)
Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
2
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