UBA2021_4

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 04 — 25 July 2008

13 of 16

NXP Semiconductors

UBA2021

630 V driver IC for CFL and TL lamps

Fig 9.

SO14 plastic small outline package

UNIT

A

max.

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0

0.4

SOT108-1

X

θ

A

D

Q

detail X

E

Z

e

c

L

(A )

3

A

7

8

1

14

y

076E06

MS-012

pin 1 index

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.35

0.34

0.16

0.15

0.05

1.05

0.041

0.244

0.228

0.028

0.024

0.028

0.012

0.01

0.25

0.01

0.004

0.039

0.016

99-12-27

03-02-19

0

2.5

5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1