TPS53353

SLUSAK2

– AUGUST 2011

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

ORDERING PART

MINIMUM

PACKAGE

PINS

OUTPUT SUPPLY

ECO PLAN

NUMBER

QUANTITY

TPS53353DQPR

Tape and reel

2500

Green (RoHS and no

Plastic QFN

–40°C to 85°C

22

Pb/Br)

(DQP)

TPS53353DQPT

Mini reel

250

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

MIN

MAX

VIN (main supply)

–0.3

25

VDD

–0.3

28

Input voltage range

VBST

–0.3

32

V

VBST(with respect to LL)

–0.3

7

EN, TRIP, VFB, RF, MODE

–0.3

7

DC

–2

25

LL

Pulse

< 20ns, E=5 μJ

–7

27

Output voltage range

V

PGOOD, VREG

–0.3

7

GND

–0.3

0.3

Source/Sink current

VBST

50

mA

–40

85

–55

150

˚C

–40

150

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TPS53353

UNITS

DQP (22 PINS)

Junction-to-ambient thermal resistance

27.2

Junction-to-case (top) thermal resistance

12.1

Junction-to-board thermal resistance

5.9

°C/W

Junction-to-top characterization parameter

0.8

Junction-to-board characterization parameter

5.8

Junction-to-case (bottom) thermal resistance

1.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Copyright

© 2011, Texas Instruments Incorporated