HT83050/HT83074

Pad No.

X

Y

Pad No.

X

Y

1

-940.400

7.150

12

-654.200

-887.900

2

-940.400

-87.850

13

-551.200

-887.900

3

-940.400

-190.850

14

940.400

-871.200

4

-940.400

-285.850

15

940.400

-776.200

5

-940.400

-388.850

16

940.600

-668.500

6

-940.400

-483.850

17

940.600

-573.000

7

-940.400

-586.850

18

896.250

-463.250

8

-940.400

-681.850

19

904.900

-363.250

9

-947.200

-887.900

20

904.900

-243.700

10

-852.200

-887.900

21

904.900

-33.200

11

-749.200

-887.900

Pad Description

Pad Name

I/O

Mask Option

Description

PA0~PA7

I/O

Wake-up,

Pull-high

or None

Bidirectional 8-bit I/O port. Each bit can be configured as a wake-up input by

mask option. Software instructions determine the CMOS output or Schmitt trig-

ger input with or without pull-high resistor (mask option).

PB0~PB3

I/O

Pull-high

or None

Bidirectional 4-bit I/O port. Software instructions determine the CMOS output or

Schmitt trigger input (pull-high resistor depending on mask option).

VSS

¾¾

Negative power supply, ground

VSSP

¾¾

PWM negative power supply, ground

VDD

¾¾

Positive power supply

VDDP

¾¾

PWM positive power supply, ground

RES

I

¾

Schmitt trigger reset input, active low

OSC1,

OSC2

¾

RC or Crystal

OSC1 and OSC2 are connected to an RC network or crystal (by mask option)

for the internal system clock. In the case of RC operation, OSC2 is the output

terminal for 1/4 system clock. The system clock may came form the crystal, the

two pins cannot be floating.

PWM1,

PWM2

O

¾

PWM output for driving a external transistor or speaker

Absolute Maximum Ratings

Storage Temperature ...........................

-50°Cto125°C

Operating Temperature ..........................

-40°Cto85°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

HT83XXX

Rev. 1.60

5

November 19, 2008