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AFS090 Datasheet(PDF) 215 Page - Microsemi Corporation |
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AFS090 Datasheet(HTML) 215 Page - Microsemi Corporation |
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215 / 334 page ![]() Fusion Family of Mixed Signal FPGAs R e visio n 2 2 - 199 3.3 V PCI, 3.3 V PCI-X The Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI Bus applications. AC loadings are defined per the PCI/PCI-X specifications for the datapath; Microsemi loadings for enable path characterization are described in Figure 2-121. AC loadings are defined per PCI/PCI-X specifications for the data path; Microsemi loading for tristate is described in Table 2-135. Table 2-134 • Minimum and Maximum DC Input and Output Levels 3.3 V PCI/PCI-X VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1 IIH2 Drive Strength Min. V Max. V Min. V Max. V Max. V Min. VmA mA Max. mA3 Max. mA3 µA4 µA4 Per PCI specification Per PCI curves 10 10 Notes: 1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL. 2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is larger when operating outside recommended ranges. 3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage. 4. Currents are measured at 85°C junction temperature. Figure 2-121 • AC Loading Test Point Enable Path R = 1 k Test Point Data Path R = 25 R to VCCI for tDP (F) R to GND for tDP (R) R to VCCI for tLZ / tZL / tZLS R to GND for tHZ / tZH / tZHS 10 pF for tZH / tZHS / tZL / tZLS 10 pF for tHZ / tLZ Table 2-135 • AC Waveforms, Measuring Points, and Capacitive Loads Input Low (V) Input High (V) Measuring Point* (V) VREF (typ.) (V) CLOAD (pF) 0 3.3 0.285 * VCCI for tDP(R) 0.615 * VCCI for tDP(F) –10 Note: *Measuring point = Vtrip. See Table 2-90 on page 2-168 for a complete table of trip points. |
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