AFS090 datasheet(191/334 Pages) MICROSEMI

191 / 334 page

Fusion Family of Mixed Signal FPGAs

R e visio n 2

2 - 175

The length of time an I/O can withstand IOSH/IOSL events depends on the junction temperature. The

reliability data below is based on a 3.3 V, 36 mA I/O setting, which is the worst case for this type of

analysis.

For example, at 100°C, the short current condition would have to be sustained for more than six months

to cause a reliability concern. The I/O design does not contain any short circuit protection, but such

protection would only be needed in extremely prolonged stress conditions.

2.5 V LVCMOS

2 mA

4 mA

6 mA

8 mA

12 mA

16 mA

24 mA

169

124

1.8 V LVCMOS

2 mA

4 mA

6 mA

8 mA

12 mA

16 mA

1.5 V LVCMOS

2 mA

4 mA

6 mA

8 mA

12 mA

3.3 V PCI/PCI-X

Per PCI/PCI-X

specification

103

109

Applicable to Standard I/O Banks

3.3 V LVTTL / 3.3 V LVCMOS

2 mA

4 mA

6 mA

8 mA

2.5 V LVCMOS

2 mA

4 mA

6 mA

8 mA

1.8 V LVCMOS

2 mA

4 mA

1.5 V LVCMOS

2 mA

Table 2-98 • I/O Short Currents IOSH/IOSL (continued)

Drive Strength

IOSH (mA)*

IOSL (mA)*

Note:

*TJ = 100°C

AFS090 Datasheet(PDF) 191 Page - Microsemi Corporation

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