AGL015 datasheet(95/248 Pages) MICROSEMI

95 / 248 page

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3.3 V PCI, 3.3 V PCI-X

Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI Bus

applications.

AC loadings are defined per the PCI/PCI-X specifications for the datapath; Microsemi loadings for enable

path characterization are described in Figure 2-12.

AC loadings are defined per PCI/PCI-X specifications for the datapath; Microsemi loading for tristate is

described in Table 2-142.

Table 2-141 • Minimum and Maximum DC Input and Output Levels

Applicable to Advanced and Standard Plus I/Os

3.3 V PCI/PCI-X

VIL

VIH

VOL

VOH

IOL IOH

IOSH

IOSL

IIL

IIH

Drive Strength

Min.

Max.

Min.

Max.

Min.

VmA mA

Max.

mA1

Max.

mA1

µA2 µA2

Per PCI

specification

Per PCI curves

Notes:

1. Currents are measured at 100°C junction temperature and maximum voltage.

2. Currents are measured at 85°C junction temperature.

Figure 2-12 • AC Loading

Test Point

Enable Path

R to VCCI for tLZ / tZL / tZLS

10 pF for tZH / tZHS / tZL / tZLS

5 pF for tHZ / tLZ

R to GND for tHZ / tZH / tZHS

R = 1 k

Test Point

Datapath

R = 25

R to VCCI for tDP (F)

R to GND for tDP (R)

Table 2-142 • AC Waveforms, Measuring Points, and Capacitive Loads

Input Low (V)

Input High (V)

Measuring Point* (V)

CLOAD (pF)

3.3

0.285 * VCCI for tDP(R)

0.615 * VCCI for tDP(F)

* Measuring point = Vtrip. See Table 2-29 on page 2-28 for a complete table of trip points.

AGL015 Datasheet(PDF) 95 Page - Microsemi Corporation

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