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AGL015 Datasheet(PDF) 2 Page - Microsemi Corporation

Part # AGL015
Description  IGLOO Low Power Flash FPGAs with Flash*Freeze Technology
PDF  248 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

AGL015 Datasheet(HTML) 2 Page - Microsemi Corporation

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IGLOO Low Power Flash FPGAs
II
R evis i o n 19
I/Os Per Package1
IGLOO Devices
AGL015
AGL030 AGL060
AGL125
AGL250
AGL400
AGL600
AGL1000
ARM-Enabled
IGLOO Devices
M1AGL250
M1AGL600
M1AGL1000
Package
I/O Type2
QN48
–34
–
–
–
–
–
–
–
–
–
–
QN68
49
49
–
–
–
–
–
–
–
–
–
–
UC81
–66
–
–
–
–
–
–
–
–
–
–
CS81
–66
–
–
60
7
–
–
–
–
–
–
CS121
––
96
96
–
–
–
–
–
–
–
–
VQ100
–77
71
71
68
13
–
–
–
–
–
–
QN132
–81
80
84
874
194
––
–
–
–
–
CS196
–
–
–
133
1434
354
143
35
–
–
–
–
FG144
–
–
96
97
97
24
97
25
97
25
97
25
FG2565
–
–
–
–
–
–
178
38
177
43
177
44
CS281
–
–
–
–
–
–
–
–
215
53
215
53
FG4845
–
–
–
–
–
–
194
38
235
60
300
74
Notes:
1. When considering migrating your design to a lower- or higher-density device, refer to the IGLOO FPGA Fabric User’s Guide to
ensure compliance with design and board migration requirements.
2. When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not used as a regular I/O, the number of single-
ended user I/Os available is reduced by one.
3. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
4. The M1AGL250 device does not support QN132 or CS196 packages.
5. FG256 and FG484 are footprint-compatible packages.
Table 1 • IGLOO FPGAs Package Sizes Dimensions
Package
UC81
CS81
CS121
QN48
QN68
QN132
CS196
CS281
FG144
VQ100
FG256
FG484
Length × Width
(mm\mm)
4 × 4
5 × 5
6 × 6
6 × 6
8 × 8
8 × 8
8 × 8
10 × 10
13 × 13 14 × 14
17 × 17
23 × 23
Nominal Area
(mm2)
16
25
36
36
64
64
64
100
169
196
289
529
Pitch (mm)
0.4
0.5
0.5
0.4
0.4
0.5
0.5
0.5
1.0
0.5
1.0
1.0
Height (mm)
0.80
0.80
0.99
0.90
0.90
0.75
1.20
1.05
1.45
1.00
1.60
2.23



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