Bonding, Handling, and Mounting Procedures for

Millimeterwave PHEMT MMIC’s

M/A-COM Products

Rev. V4

Application Note

M570

4

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Wedge bond with 1.0 mil diameter gold wire or 3.0 mil x

0.0005 mil ribbon and a force of 18 to 22 grams. Bonds

should be started on the die and terminated on the pack-

age, if possible. For RF connections, two wires are rec-

ommended. Most bonding pads are 4.0 x 4.0 mils and

most input and output pads are 4.0 x 4.0 mils.

Most problems are caused by improper bonding machine

and tool settings as well as improper maintenance and

cleanliness. It is important to control the movement of

the part being bonded, alignment of tools, tool height,

angle, and tool condition.

In general, the die will crack or “crater” if too hard a wire

or excessive pressure is used. Too little pressure results

in small, weak bonds.

A good wire bond should be

stronger than the wire and should also be two or three

times the wire diameter.

When wire bonding, the de-

formed width of the wire should be about 1.3 to 1.8 times

the wire thickness. If the deformed width is too small,

the bond will tend to lift off. If it is too large (greater than

1.8 times the wire diameter) the wire tends to weaken

and break. Figure 2 shows the relationship between the

pull strength and the deformed width of the ultrasonic

bonded wire.

Acceptable Bonds

Wire does not separate when tested

No fractures in bond

No separation of metallization

Wire breaks before bond

Unacceptable Bonds

Wire separates from bond

Bond fractures at weld

Separation of metallization from dice

Table 3. Bond Strength Criteria (Gold Wire or Strap)

Bond Strength Pull Test

It is extremely important to maintain good quality control

procedures in order to ensure good bonding. Figure 3

and Table 3 illustrate criteria for visual inspection and for

testing on bond strength.

Capacitors and Resistors

It is recommended that capacitors and resistors are

selected that meet at least the same temperature

ranges as the MMICs. The following are recom-

mended devices to use.

Capacitors

Dielectric Laboratories

100 pF

P/n D30BH101K5PK or equivalent

1000 pF

P/n D35BV102KPX or equivalent

Resistors

Mini-Systems, Inc.

10 WP/n MSTF-2ST-10R00J-G or equivalent

Wire or Ribbon Size

(inches)

Minimum Pull Strength

(grams)

0.0007 wire diameter

1.5

0.001 wire diameter

3.0

0.002 wire diameter

9.0

Figure 2. Pull Strength vs. Deformation for a

Wirebond

Figure 3.