3

SY89321L

Micrel, Inc.

M9999-060208

hbwhelp@micrel.com or (408) 955-1690

Supply Voltage (V

Input Voltage (V

LVTT Output Current (I

Continuous ............................................................. 50mA

Surge .................................................................... 100mA

Current (V

Source or sink current on V

Lead Temperature (soldering, 20 sec.) ................... +260

°C

Storage Temperature (T

Supply Voltage (V

Ambient Temperature (T

Package Thermal Resistance, Note 4

θ

Still-Air ................................................................. 93

°C/W

500lfpm ............................................................... 87

°C/W

Ψ

Junction-to-Board ................................................ 60

°C/W

V

Symbol

Parameter

Condition

Min

Typ

Max

Units

I

OS

Output Short Circuit Current

V

–80

—–275

mA

I

CC

Power Supply Current

—

14

20

mA

V

OH

Output HIGH Voltage

I

2.0

——

V

V

OL

Output LOW Voltage

I

——

0.5

V

LVTTL DC ELECTRICAL CHARACTERISTICS

V

Symbol

Parameter

Condition

Min

Typ

Max

Units

V

IH_LVPECL

Input HIGH Voltage

V

—

V

V

V

IL_LVPECL

Input LOW Voltage

V

—

V

V

V

BB

Bias Voltage

V

V

V

V

V

IH_CML

Input HIGH Voltage

V

—

V

CC

V

V

IL_CML

Input LOW Voltage

V

—

V

V

V

IH_LVDS

Input HIGH Voltage

1.4

—

1.5

V

V

IL_LVDS

Input LOW Voltage

1.1

—

1.2

V

I

IH

Input HIGH Current

——

150

µA

I

IL

Input LOW Current IN

0.5

——

µA

Input LOW Current /IN

–300

——

µA

Note 1.

Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not

implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions

for extended periods may affect device reliability.

Note 2.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

Note 3.

Due to the limited drive capability use for input of the same package only.

Note 4.

Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential (GND) on the PCB.

Note 5.

Max. limit only applicable for short durations, not for continuous operation!

LVPECL/CML/LVDS DC ELECTRICAL CHARACTERISTICS