Z0107NN

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 05 — 22 March 2011

6 of 14

NXP Semiconductors

Z0107NN

4Q Triac

5.

Thermal characteristics

Table 5.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction to

solder point

full cycle; see Figure 7

--15

K/W

thermal resistance from junction to

ambient

full cycle; printed circuit board

mounted; minimum footprint;

see Figure 6

-

156

-

K/W

full cycle; printed circuit board

mounted; pad area; see Figure 6

-70

-

K/W

All dimensions are in mm

Fig 6.

Minimum footprint SOT223

Fig 7.

Transient thermal impedance from junction to solder point as a junction of pulse width

001aab508

3.8 min

1.5

min

1.5

min

(3

×)

2.3

4.6

6.3

1.5

min

003aac210

10

-2

10

-1

1

10

10

2

10

-5

10

-4

10

-3

10

-2

1

10

(K/W)

P

t

10

-1