44 PIN

DDV PACKAGE

(TOP VIEW)

VDD

OC_ADJ

RESET

INPUT_A

INPUT_B

C_START

DVDD

GND

GND

GND

GND

AVDD

INPUT_C

INPUT_D

FAULT

OTW

CLIP

M1

M2

M3

GVDD_CD

BST_C

GVDD_AB

GVDD_AB

GND

GND

OUT_D

OUT_D

PVDD_CD

PVDD_CD

PVDD_CD

OUT_C

GND

GND

OUT_B

PVDD_AB

PVDD_AB

PVDD_AB

OUT_A

OUT_A

GND

GND

BST_B

BST_A

BST_D

TAS5622A

SLAS845 – MAY 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

GENERAL INFORMATION

Terminal Assignment

The TAS5622A is available in a thermally enhanced package:

•

44-Pin HTSSOP package (DDV)

The package contains a PowerPAD™ that is located on the top side of the device for convenient thermal

coupling to the heat sink.

2

Submit Documentation Feedback

Copyright © 2012, Texas Instruments Incorporated

Product Folder Link(s): TAS5622A