TLV62090

SLVSBB9B – MARCH 2012 – REVISED APRIL 2012

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING

PACKAGE

PACKAGE MARKING

-40°C to 85°C

TLV62090

RGT

SBV

(1)

For detailed ordering information please see the PACKAGE OPTION ADDENDUM section at the end

of the datasheet.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

–0.3

7

V

Voltage range

SW, PG

–0.3

V

Power Good sink current

PG

1

mA

Human Body Model

2

kV

ESD rating

Charged Device Model

500

V

Continuous total power dissipation

See the Thermal Table

–40

150

°C

–40

85

°C

–65

150

°C

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

THERMAL INFORMATION

TPS62090

UNITS

QFN (16 PINS)

Junction-to-ambient thermal resistance

47

Junction-to-case (top) thermal resistance

60

Junction-to-board thermal resistance

20

°C/W

Junction-to-top characterization parameter

1.5

Junction-to-board characterization parameter

20

Junction-to-case (bottom) thermal resistance

5.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

(1)

MIN

TYP

MAX

UNIT

2.5

5.5

V

Operating ambient temperature

–40

85

°C

Operating junction temperature

–40

125

°C

(1)

See the application section for further information

2

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