ULN2003LV

SLRS059A – APRIL 2012 – REVISED APRIL 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PART NUMBER

PACKAGE

TOP-SIDE MARKING

ULN2003LVDR

16-Pin SOIC

Reel of 2500

UN2003LV

–40°C to 85°C

ULN2003LVPWR

16-Pin TSSOP

Reel of 2000

UN2003LV

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

MIN

MAX

Pins IN1- IN7 to GND voltage

–0.3

5.5

V

Pins OUT1 – OUT7 to GND voltage

8

V

Pin COM to GND voltage

8

V

700

mA

1.0

A

16 Pin - SOIC

0.58

W

16 Pin -TSSOP

0.45

W

ESD Rating – HBM

2

kV

ESD

ESD Rating – CDM

500

V

Operating free-air ambient temperature range

–40

85

°C

Operating virtual junction temperature

–55

150

°C

Storage temperature range

–55

150

°C

(1)

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for

extended periods may affect device reliability.

DISSIPATION RATINGS

(1) (2)

BOARD

PACKAGE

(3)

DERATING

FACTOR ABOVE

High-K

16-Pin SOIC

69°C/W

112°C/W

8.88 mW/ºC

1.11 W

0.71 W

0.58 W

High-K

16-Pin TSSOP

74°C/W

142°C/W

7.11 mW/ºC

0.88 W

0.56 W

0.45 W

(1)

Maximum dissipation values for retaining device junction temperature of 150°C

(2)

Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance

(3)

2

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