ULN2003LVDR datasheet(5/19 Pages) TI1

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OLi

i 1

(

)

J(MAX)

(MAX)

ULN2003LV

www.ti.com

SLRS059A – APRIL 2012 – REVISED APRIL 2012

APPLICATION INFORMATION

TTL and other Logic Inputs

ULN2003LV input interface is specified for standard 3V and 5V CMOS logic interface. However, ULN2003LV

input interface may support other logic input levels as well. Refer to Figure 10 and Figure 11 to establish VOL

and the corresponding typical load current levels for various input voltage ranges. Application Information section

shows an implmentation to drive 1.8V relays using ULN2003LV.

Input RC Snubber

ULN2003LV features an input RC snubber that helps prevent spurious switching in noisy environment. Connect

an external 1k

Ω to 5kΩ resistor in series with the input to further enhance ULN2003LV’s noise tolerance.

High-impedance Input Drivers

ULN2003LV features a 300k

Ω input pull-down resistor. The presence of this resistor allows the input drivers to

be tri-stated. When a high-impedance driver is connected to a channel input the ULN2003LV detects the channel

input as a low level input and remains in the OFF position. The input RC snubber helps improve noise tolerance

when input drivers are in the high-impedance state.

On-chip Power Dissipation

Use the below equation to calculate ULN2003LV on-chip power dissipation PD:

Where:

N is the number of channels active together.

VOLi is the OUTi pin voltage for the load current ILi.

(1)

Thermal Reliability

It is recommended to limit ULN2003LV IC’s die junction temperature to less than 125°C. The IC junction

temperature is directly proportional to the on-chip power dissipation. Use the following equation to calculate the

maximum allowable on-chip power dissipation for a target IC junction temperature:

Where:

TJ(MAX) is the target maximum junction temperature.

TA is the operating ambient temperature.

θJA is the package junction to ambient thermal resistance.

(2)

Improving Package Thermal Performance

The package

θJA value under standard conditions on a High-K board is listed in the DISSIPATION RATINGS. θJA

value depends on the PC board layout. An external heat sink and/or a cooling mechanism, like a cold air fan, can

help reduce

θJA and thus improve device thermal capabilities. Refer to TI’s design support web page at

www.ti.com/thermal for a general guidance on improving device thermal performance.

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