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MPC8377E Datasheet(PDF) 114 Page - Freescale Semiconductor, Inc |
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MPC8377E Datasheet(HTML) 114 Page - Freescale Semiconductor, Inc |
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114 / 127 page  MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8 114 Freescale Semiconductor 24 Thermal This section describes the thermal specifications of this chip. 24.1 Thermal Characteristics This table provides the package thermal characteristics for the 689 31 × 31mm TePBGA II package. 48.0 0 1 2 3 576 144 288 72 6 36 18 — — — 360 432 66.7 0 1 2 2 533 133 266 66.7 33.3 16.7 — — — 333 400 25.0 0 0 4 8 800 200 200 100 6 50 25 — — 400 500 600 33.3 0 0 2 8 533 266.7 267 133 6 66.7 33.3 — 400 533 667 800 50.0 0 0 4 4 800 200 200 100 6 50 25 — — 400 500 600 50.0 0 0 2 8 800 400 400 5 — 100 6 50 — 600 800 — — 66.7 0 0 2 4 533 266.7 267 133 6 66.7 33.3 — 400 533 667 800 66.7 0 0 2 5 667 333 333 — 83.3 6 41.6 333 500 667 — — 66.7 0 0 2 6 800 400 400 5 — 100 6 50 400 600 800 — — Notes: 1. Values in MHz. 2. System PLL VCO range: 400–800 MHz. 3. CSB frequencies less than 133 MHz will not support Gigabit Ethernet rates. 4. Minimum data rate for DDR2 is 250 MHz and for DDR1 is 167 MHz. 5. Applies to DDR2 only. 6. Applies to eLBC PLL-enabled mode only. Table 81. Package Thermal Characteristics for TePBGA II Parameter Symbol Value Unit Note Junction-to-ambient natural convection on single layer board (1s) RθJA 21 °C/W 1, 2 Junction-to-ambient natural convection on four layer board (2s2p) RθJA 15 °C/W 1, 2, 3 Junction-to-ambient (at 200 ft/min) on single layer board (1s) RθJMA 16 °C/W 1, 3 Junction-to-ambient (at 200 ft/min) on four layer board (2s2p) RθJMA 12 °C/W 1, 3 Junction-to-board thermal RθJB 8 °C/W 4 Junction-to-case thermal RθJC 6 °C/W 5 Table 80. Example Clock Frequency Combinations (continued) eLBC 1 e300 Core 1 Ref 1 LBCM DDRCM SVCOD SPMF Sys VCO 1,2 CSB 1,3 DDR data rate 1,4 /2 /4 /8 × 1 × 1.5 × 2 × 2.5 × 3 |
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