TLE 5216 G

Semiconductor Group

17

1998-06-22

Package Outlines

-0.3

1.2

2.8

1) Does not include plastic or metal protrusion of 0.15 max. per side

20x

1)

Heatsink

0.95

14.2

Index Marking

15.9

10

1

0.1

+0.13

0.4

1.27

6.3

11

20

11

±0.15

±0.15

1 x 45˚

±0.3

±0.15

A

A

1)

B

GPS05791

P-DSO-20-10

(Plastic Dual Small Outline Package)

Sorts of Packing

Package outlines for tubes, trays etc. are contained in our

Data Book “Package Information”.

Dimensions in mm

SMD = Surface Mounted Device