DS1321

6 of 13

ABSOLUTE MAXIMUM RATINGS

Voltage Range on Any Pin Relative to Ground

-0.5V to +6.0V

Operating Temperature Range

-40°C to +85°C

Storage Temperature Range

-55°C to +125°C

Soldering Temperature (reflow, SO or TSSOP)

+260°C

Lead Temperature (soldering, 10s)

+300°C

This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the

operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of

time may affect reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

PDIP

SO

TSSOP

Note 1:

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board

for the SMT packages. For detailed information on package thermal considerations, refer to

www.maxim-ic.com/thermal-tutorial.

RECOMMENDED OPERATING CONDITIONS

(-40°C to +85°C)

PARAMETER

SYMBOL

MIN

TYP

MAX

UNITS

NOTES

Supply Voltage TOL=GND

4.75

5.0

5.5

V

2

4.5

5.0

5.5

V

2

Battery Supply Voltage

2.0

3.0

6.0

V

2

Logic 1 Input

2.0

V

2. 13

Logic 0 Input

-0.3

+0.8

V

2, 13

DC ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

MIN

TYP

MAX

UNITS

NOTES

Operating Current (TTL inputs)

1

1.5

mA

3

Operating Current (CMOS inputs)

100

150

µA

3, 6

RAM Supply Voltage

-0.2

V

2

RAM Supply Current

185

mA

4

Supply Current

260

mA

5

4.50

4.62

4.75

V

2

4.25

4.37

4.50

V

2

2.50

2.6

2.70

V

2

Output Current @ 2.2V

-1

mA

8, 11

Output Current @ 0.4V

4

mA

8, 11